PCG0E272MCL1GS

The PCG0E272MCL1GS from Nichicon is a surface-mount conductive polymer aluminum solid electrolytic capacitor in the PCG series, offering 2.7 mF capacitance at a 2.5 V rating. It combines high capacitance density in a compact φ10 × 10 mm SMD can with electrical characteristics targeted for demanding environments.

Key attributes include low ESR, high ripple current capability, wide operating temperature range, and an AEC‑Q200 rating for automotive applications—making it suitable for designs that require durable, high-performance energy storage on the board.

Key Features

• Capacitance & Voltage — 2.7 mF (2700 µF) capacitance at a rated voltage of 2.5 V, with tolerance ±20% at 20°C, 120 Hz.
• Conductive Polymer Electrolyte — Solid conductive polymer construction for stable electrical performance and predictable endurance over life.
• Low ESR & High Frequency Performance — ESR of 12 mΩ measured at 100 kHz (20°C), supporting high-frequency smoothing and stable operation.
• High Ripple Current Capability — Low-frequency ripple current of 2.35 A (120 Hz) and high-frequency ripple current of 4.7 A (100 kHz) for robust power-handling in switching environments.
• Wide Temperature & Endurance — Operating temperature range from −55°C to +105°C with endurance specified at 2000 hours at 105°C under rated voltage.
• Compact SMD Package — φ10 × 10 mm radial can in surface-mount format supplied in embossed carrier taping with moisture-proof packing for assembly.
• AEC‑Q200 Rated — Rated to AEC‑Q200, indicating suitability for automotive electronics applications where that qualification is required.

Typical Applications

• Automotive electronics — AEC‑Q200 rating plus wide temperature range and 2000 h endurance at 105°C make this capacitor suitable for on-board automotive power systems that demand reliability under thermal stress.
• Power supply filtering and bulk decoupling — 2.7 mF capacitance with low ESR (12 mΩ) and high ripple current capabilities (up to 4.7 A at 100 kHz) supports smoothing and decoupling in compact power modules.
• High-frequency power stages — High-frequency ripple current rating and low ESR are appropriate for use in switching regulators and other high-frequency power-management circuits.
• Space-constrained SMD designs — The φ10 × 10 mm SMD can delivers substantial capacitance in a small footprint for board-level energy storage where PCB area is limited.

Unique Advantages

• High capacitance in a compact SMD package: 2.7 mF in a φ10 × 10 mm can reduces PCB area required for bulk capacitance.
• High ripple-current handling: Rated for 2.35 A at 120 Hz and 4.7 A at 100 kHz, enabling reliable operation in both low- and high-frequency power environments.
• Low ESR at high frequency: 12 mΩ ESR at 100 kHz minimizes losses and improves voltage stability under dynamic loads.
• Robust thermal performance and endurance: −55°C to +105°C operating range and 2000 hours endurance at 105°C under rated voltage provide long-term reliability in thermally demanding applications.
• Automotive-grade qualification: AEC‑Q200 rating aligns the component with automotive design requirements for qualified passive components.
• Production-ready packaging: Supplied in embossed carrier taping with moisture-proof packing to streamline pick-and-place assembly and handling.

Why Choose PCG0E272MCL1GS?

PCG0E272MCL1GS positions itself as a high-capacitance, low-ESR SMD solution for designers who need reliable bulk capacitance and strong ripple-current performance in a compact form factor. Its conductive polymer construction, AEC‑Q200 rating, and specified endurance at elevated temperature make it suitable for electronics that require sustained operation across wide thermal ranges.

This part is well suited to engineers and procurement teams designing automotive power systems, high-frequency power supplies, and space-constrained boards that demand stable decoupling and energy storage over the lifetime of the product. Backed by Nichicon’s PCG series specifications, it offers verifiable performance metrics for robust system-level design decisions.

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