PCG0E331MCL1GS

The PCG0E331MCL1GS is a conductive polymer aluminum solid electrolytic capacitor in a compact chip-style surface-mount package. It provides 330 µF of capacitance at a 2.5 V rating and is designed for applications that require high capacitance in a small SMD footprint.

With AEC-Q200 qualification and an operating temperature range of -55°C to 105°C, this capacitor addresses demanding automotive and industrial environments where long-term endurance and low impedance at high frequency are important.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance at a rated voltage of 2.5 V with ±20% tolerance (120 Hz, 20°C).
• Low ESR — Equivalent series resistance of 30 mΩ measured at 100 kHz for improved high-frequency performance.
• Ripple Current Handling — Rated ripple current of 1.1 A at 120 Hz and 2.2 A at 100 kHz to support smoothing and transient loads.
• Temperature & Endurance — Operating range from -55°C to 105°C and endurance of 2000 hours at 105°C under rated voltage.
• Automotive Qualification — AEC-Q200 rating for use in automotive electronic assemblies where that qualification is required.
• Package & Mounting — Chip-type radial can configured for surface-mount assembly; size dimension L: 6 × D: 5 mm with recommended land size 5.3 × 5.3 mm.
• Polarized Electrolyte — Polarized device suitable for DC decoupling and bulk energy storage on power rails.

Typical Applications

• Automotive electronic systems — AEC-Q200 qualification and -55°C to 105°C operation make this capacitor suitable for electronic control units and modules in automotive environments.
• Power supply decoupling and filtering — Low ESR (30 mΩ at 100 kHz) combined with rated ripple currents supports smoothing, decoupling, and transient suppression on DC rails.
• Space-constrained SMD designs — High capacitance (330 µF) in a compact 6 × 5 mm chip package helps minimize board area while maintaining required bulk capacitance.

Unique Advantages

• High capacitance in a compact footprint: 330 µF provided in a 6 × 5 mm chip package reduces board area compared to larger through-hole parts.
• Effective high-frequency performance: 30 mΩ ESR at 100 kHz improves filtering and reduces voltage ripple under dynamic loads.
• Designed for demanding environments: AEC-Q200 rating and -55°C to 105°C temperature range support reliability in automotive and industrial applications.
• Long-term thermal endurance: Specified for 2000 hours at 105°C under rated voltage for predictable in-field life under high-temperature conditions.
• Robust ripple handling: Dual ripple current ratings (1.1 A at 120 Hz and 2.2 A at 100 kHz) give designers quantifiable limits for AC stress and thermal planning.
• SMD-ready package: Radial can, chip-type SMD package with recommended land size simplifies surface-mount assembly and PCB layout.

Why Choose PCG0E331MCL1GS?

PCG0E331MCL1GS is positioned for designs that require high capacitance density, low impedance at high frequency, and automotive-grade qualification. Its combination of 330 µF capacitance, 2.5 V rating, low ESR, and quantified ripple current capability makes it a practical choice for power filtering and bulk energy storage in compact SMD applications.

This part is suited to engineers and procurement teams building temperature-stable, reliable electronic subsystems—particularly where AEC-Q200 qualification and predictable lifetime at elevated temperature are important. Its SMD form factor and recommended land pattern help simplify integration into modern PCB assemblies.

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