10AX057K1F35E1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 42082304 570000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 30 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057K1F35E1HG – Arria 10 GX FPGA (570,000 logic elements, 42,082,304 RAM bits, 492 I/Os, 1152‑FCBGA)
The 10AX057K1F35E1HG is an Intel Arria 10 GX field programmable gate array supplied in a 1152‑ball FCBGA (35 × 35) surface‑mount package. Built on the Arria 10 device family architecture, this device provides high logic capacity, substantial on‑chip RAM, and a large I/O count suitable for midrange, performance‑sensitive applications.
This device targets markets such as wireless infrastructure, wireline and networking, broadcast, computing and storage, and advanced instrumentation where a combination of logic density, embedded memory, and extensive I/O is required. It is designed for power‑efficient operation on a 20‑nm FPGA architecture and is RoHS compliant.
Key Features
- Logic Capacity – 570,000 logic elements to implement complex programmable logic and custom processing functions.
- Embedded Memory – 42,082,304 total RAM bits of on‑chip memory to support large buffering, caches, and memory‑intensive designs.
- I/O Resources – 492 available I/O pins for wide external interfacing and parallel connectivity.
- Package & Mounting – 1152‑FCBGA (35 × 35) surface‑mount package, 1152‑BBGA case, suitable for compact board layouts.
- Power Envelope – Core supply range 870 mV–980 mV to match system power domains and regulator designs.
- Operating Range – Specified for 0 °C to 100 °C ambient operating temperature (extended grade).
- Arria 10 Family Capabilities – Series features documented for Arria 10 devices include 20‑nm midrange FPGA architecture, adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks with PLLs, configurable transceivers, PCIe Gen1/2/3 hard IP, and options for SoC integration and dynamic/partial reconfiguration.
- Compliance – RoHS compliant.
Typical Applications
- Wireless Infrastructure – Channel and switch cards in remote radio heads and mobile backhaul equipment that require programmable logic density and substantial embedded memory.
- Wireline & Networking – 40G/100G muxponders, transponders and line cards where high I/O count and large memory resources support packet buffering and protocol offload.
- Broadcast & Professional AV – Studio switches and video transport systems requiring flexible logic for signal processing and deterministic I/O handling.
- Computing & Storage Acceleration – Server acceleration and flash cache controllers leveraging on‑chip logic and memory for low‑latency data paths.
- Advanced Instrumentation – Diagnostic imaging and other instrumentation applications that benefit from high logic density and configurable processing pipelines.
Unique Advantages
- High Logic Density: 570,000 logic elements enable implementation of large-scale custom logic, accelerators, and complex state machines within a single device.
- Large On‑Chip Memory: 42,082,304 RAM bits provide extensive embedded storage for buffering, lookup tables, and dataflow staging without external memory in some use cases.
- Extensive I/O Count: 492 I/Os allow broad external connectivity for interfaces, parallel buses, and mixed signal front‑ends.
- Compact, Surface‑Mount Package: 1152‑FCBGA (35 × 35) offers a high‑density board footprint for space‑constrained designs.
- Power Flexibility: Core supply range of 870 mV–980 mV supports a range of system power architectures and regulator selections.
- Extended Operating Grade: Rated for 0 °C to 100 °C operation, suitable for many commercial and enterprise environments.
- Arria 10 Series Feature Set: Access to Arria 10 family capabilities such as DSP blocks, PLLs, transceivers, PCIe hard IP, and configuration options that support complex system integration.
Why Choose 10AX057K1F35E1HG?
The 10AX057K1F35E1HG combines high logic element count, large embedded RAM, and a broad I/O set in a compact 1152‑ball FCBGA package, making it well suited for midrange applications that require programmable performance and on‑device memory. As a member of the Intel Arria 10 family, it leverages a 20‑nm FPGA architecture and the family’s documented features for power‑efficient, high‑performance designs.
This device is a fit for design teams building wireless infrastructure, high‑speed networking, broadcast systems, computing accelerators, and advanced instrumentation who need scalable logic, significant on‑chip memory, and flexible I/O in an extended‑grade FPGA package backed by Arria 10 family documentation.
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