5AGXBB5D4F40I5N

The 5AGXBB5D4F40I5N is an Arria V GX field-programmable gate array (FPGA) IC from Intel, delivered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It provides high-density programmable logic, abundant on-chip memory, and extensive I/O capacity for demanding embedded and industrial designs.

Key electrical and environmental parameters supplied with the device include a core voltage range of 1.07 V to 1.13 V and an industrial operating temperature range of −40 °C to 100 °C. The part is RoHS compliant and intended for industrial-grade applications.

Key Features

• High logic density — Approximately 420,000 logic elements to support complex, resource-intensive designs and large-scale custom logic implementations.
• Embedded memory — Approximately 23.6 Mbits of on-chip RAM for buffering, data storage, and local processing without external memory.
• Extensive I/O — Up to 704 I/O pins, enabling broad peripheral connectivity and high-pin-count system integration.
• Package and mounting — 1517-BBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C to meet extended-environment deployments.
• Core voltage — Nominal supply range of 1.07 V to 1.13 V for the device core.
• Regulatory compliance — RoHS compliant, supporting environmentally conscious design and assembly.

Typical Applications

• High-density programmable logic systems — Designs that require roughly 420,000 logic elements and significant on-chip RAM can leverage this device for integrated custom logic implementation.
• Industrial control and instrumentation — The industrial temperature rating (−40 °C to 100 °C) and extensive I/O make the part suitable for rugged control, measurement, and automation platforms.
• High-I/O interface boards — Systems that need up to 704 I/O in a compact 1517-BBGA (40×40) package benefit from the device’s I/O capacity and surface-mount packaging.

Unique Advantages

• Large programmable fabric: Approximately 420,000 logic elements enable implementation of complex state machines, datapaths, and parallel processing blocks without extensive external logic.
• On-chip memory footprint: Around 23.6 Mbits of embedded RAM reduces dependency on external memory, simplifying board design and improving data locality.
• High connectivity: Up to 704 I/O pins provide flexibility for interfacing with sensors, high-speed peripherals, and multi-channel systems.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to support extended-temperature deployments and reliable operation in harsher environments.
• Compact BGA packaging: The 1517-BBGA / 1517-FBGA (40×40) package delivers a dense solution footprint for space-constrained boards while retaining high I/O counts.
• RoHS compliant: Meets common environmental and assembly requirements for modern electronics manufacturing.

Why Choose 5AGXBB5D4F40I5N?

The 5AGXBB5D4F40I5N Arria V GX FPGA combines high logic density, substantial on-chip memory, and a large I/O complement in a compact BGA package, making it appropriate for embedded systems that require significant programmable resources and flexible interfacing. Its industrial temperature rating and RoHS compliance support deployment in applications with extended environmental requirements.

This part is suited to design teams and integrators building high-density programmable solutions that need integrated memory and broad I/O capability while maintaining a compact board footprint and industrial operating range.

Request a quote or submit an inquiry for part 5AGXBB5D4F40I5N to discuss availability, lead times, and volume pricing. Consult the Arria V device datasheet for series-level electrical characteristics and configuration details relevant to system design.