5CEBA2F23C7N

IC FPGA 224 I/O 484FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA

Quantity 885 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O224Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9434Number of Logic Elements/Cells25000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2002944

Overview of 5CEBA2F23C7N – Cyclone® V E FPGA, 25,000 logic elements, ~2.003 Mbits RAM, 224 I/Os, 484-BGA

The 5CEBA2F23C7N is an Intel Cyclone V E field-programmable gate array (FPGA) supplied in a 484-ball BGA (23×23) surface-mount package. It combines a mid-range FPGA fabric with integrated system features drawn from the Cyclone V family to address cost- and power-sensitive designs that require flexible logic, embedded memory, and a high I/O count.

With 25,000 logic elements and approximately 2.003 Mbits of embedded memory, this commercial-grade device is suitable for applications that need a balance of logic capacity, on-chip RAM, and reliable I/O in a compact 484-FBGA footprint.

Key Features

  • Logic Capacity — 25,000 logic elements provide ample programmable logic for medium-complexity designs and custom digital functions.
  • Embedded Memory — Approximately 2.003 Mbits of on-chip RAM to support packet buffering, FIFOs, LUT-based storage, and small on-chip data structures.
  • I/O Count — 224 user I/Os for broad connectivity options, enabling multiple peripheral interfaces and parallel I/O buses.
  • Process and Core Voltage — Built on 28 nm low-power process technology with a supplied core voltage range of 1.07 V to 1.13 V (nominal ~1.1 V), supporting low-voltage system designs.
  • FPGA Fabric Enhancements — Series-level features include an enhanced 8-input adaptive logic module (ALM) and variable-precision DSP resources for efficient logic packing and arithmetic processing.
  • Integrated System IP (series-level) — Cyclone V family features such as hard memory controllers, embedded M10K memory blocks, and serial transceivers are part of the device series capability set.
  • Package & Mounting — 484-FBGA (23×23) surface-mount package for high-density board integration.
  • Operating Conditions & Compliance — Commercial-grade device rated for 0 °C to 85 °C operation and RoHS-compliant.

Typical Applications

  • Industrial and Automation Control — Implement real-time control logic, sensor aggregation, and custom protocol handling where medium logic density and substantial I/O are required.
  • Communications and Networking — Use on-chip memory and logic to implement packet buffering, custom MACs, and interface bridging for wireline and wireless equipment.
  • Video and Image Processing — Leverage logic and DSP resources for preprocessing, data formatting, and streaming functions in compact video front-end systems.
  • Embedded System Acceleration — Offload compute- or I/O-intensive functions from processors using programmable fabric and on-chip RAM for latency-sensitive tasks.

Unique Advantages

  • Balanced Logic and Memory — 25,000 logic elements paired with ~2.003 Mbits of embedded RAM provide a useful combination for designs that need both programmable logic and local data storage.
  • High I/O Density — 224 I/Os facilitate multiple parallel interfaces and flexible board-level partitioning without external I/O expanders.
  • Low-Voltage Core — Narrow supply window (1.07–1.13 V) supports low-power architectures and simplifies power-rail planning for modern systems.
  • Series-Level Integration — Cyclone V family features such as 8-input ALMs, M10K memory blocks, DSP blocks, transceivers, and hard memory controllers enable faster time-to-market through prebuilt silicon capabilities.
  • Compact, Surface-Mount Package — 484-FBGA (23×23) provides high pin density in a board-friendly surface-mount format for space-constrained designs.

Why Choose 5CEBA2F23C7N?

The 5CEBA2F23C7N offers a pragmatic balance of programmable logic, embedded memory, and substantial I/O in a compact 484-BGA package, making it well suited for cost- and power-sensitive designs that require on-chip flexibility. Its core voltage range and series-level feature set support efficient board-level power architectures and integrated system functions.

This part is a good fit for engineers and teams developing mid-density FPGA-based subsystems—where integration, predictable thermal and electrical characteristics, and a mature FPGA series ecosystem matter for project schedules and long-term support.

Request a quote or submit your requirements today to receive pricing and availability for the 5CEBA2F23C7N.

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