5CEBA2F23C7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 2002944 25000 484-BGA |
|---|---|
| Quantity | 885 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 224 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9434 | Number of Logic Elements/Cells | 25000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2002944 |
Overview of 5CEBA2F23C7N – Cyclone® V E FPGA, 25,000 logic elements, ~2.003 Mbits RAM, 224 I/Os, 484-BGA
The 5CEBA2F23C7N is an Intel Cyclone V E field-programmable gate array (FPGA) supplied in a 484-ball BGA (23×23) surface-mount package. It combines a mid-range FPGA fabric with integrated system features drawn from the Cyclone V family to address cost- and power-sensitive designs that require flexible logic, embedded memory, and a high I/O count.
With 25,000 logic elements and approximately 2.003 Mbits of embedded memory, this commercial-grade device is suitable for applications that need a balance of logic capacity, on-chip RAM, and reliable I/O in a compact 484-FBGA footprint.
Key Features
- Logic Capacity — 25,000 logic elements provide ample programmable logic for medium-complexity designs and custom digital functions.
- Embedded Memory — Approximately 2.003 Mbits of on-chip RAM to support packet buffering, FIFOs, LUT-based storage, and small on-chip data structures.
- I/O Count — 224 user I/Os for broad connectivity options, enabling multiple peripheral interfaces and parallel I/O buses.
- Process and Core Voltage — Built on 28 nm low-power process technology with a supplied core voltage range of 1.07 V to 1.13 V (nominal ~1.1 V), supporting low-voltage system designs.
- FPGA Fabric Enhancements — Series-level features include an enhanced 8-input adaptive logic module (ALM) and variable-precision DSP resources for efficient logic packing and arithmetic processing.
- Integrated System IP (series-level) — Cyclone V family features such as hard memory controllers, embedded M10K memory blocks, and serial transceivers are part of the device series capability set.
- Package & Mounting — 484-FBGA (23×23) surface-mount package for high-density board integration.
- Operating Conditions & Compliance — Commercial-grade device rated for 0 °C to 85 °C operation and RoHS-compliant.
Typical Applications
- Industrial and Automation Control — Implement real-time control logic, sensor aggregation, and custom protocol handling where medium logic density and substantial I/O are required.
- Communications and Networking — Use on-chip memory and logic to implement packet buffering, custom MACs, and interface bridging for wireline and wireless equipment.
- Video and Image Processing — Leverage logic and DSP resources for preprocessing, data formatting, and streaming functions in compact video front-end systems.
- Embedded System Acceleration — Offload compute- or I/O-intensive functions from processors using programmable fabric and on-chip RAM for latency-sensitive tasks.
Unique Advantages
- Balanced Logic and Memory — 25,000 logic elements paired with ~2.003 Mbits of embedded RAM provide a useful combination for designs that need both programmable logic and local data storage.
- High I/O Density — 224 I/Os facilitate multiple parallel interfaces and flexible board-level partitioning without external I/O expanders.
- Low-Voltage Core — Narrow supply window (1.07–1.13 V) supports low-power architectures and simplifies power-rail planning for modern systems.
- Series-Level Integration — Cyclone V family features such as 8-input ALMs, M10K memory blocks, DSP blocks, transceivers, and hard memory controllers enable faster time-to-market through prebuilt silicon capabilities.
- Compact, Surface-Mount Package — 484-FBGA (23×23) provides high pin density in a board-friendly surface-mount format for space-constrained designs.
Why Choose 5CEBA2F23C7N?
The 5CEBA2F23C7N offers a pragmatic balance of programmable logic, embedded memory, and substantial I/O in a compact 484-BGA package, making it well suited for cost- and power-sensitive designs that require on-chip flexibility. Its core voltage range and series-level feature set support efficient board-level power architectures and integrated system functions.
This part is a good fit for engineers and teams developing mid-density FPGA-based subsystems—where integration, predictable thermal and electrical characteristics, and a mature FPGA series ecosystem matter for project schedules and long-term support.
Request a quote or submit your requirements today to receive pricing and availability for the 5CEBA2F23C7N.

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