5SEEBF45C3G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V E Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 495 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359250Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SEEBF45C3G – Stratix® V E Field Programmable Gate Array (FPGA) IC, 1932-BBGA FCBGA

The 5SEEBF45C3G is a Stratix V E family Field Programmable Gate Array (FPGA) in a 1932-ball FCBGA package optimized for high-density, commercial-grade digital designs. It integrates a large logic fabric and on-chip memory with high I/O count to address complex system requirements in communications, data processing, and advanced embedded applications.

With 952,000 logic elements and approximately 53.25 Mbits of embedded memory, this device delivers the integration needed to consolidate multiple functions on a single FPGA while supporting board-level surface-mount assembly and lead-free, RoHS-compliant production.

Key Features

  • Logic Capacity  952,000 logic elements and 359,250 CLBs provide substantial programmable logic resources for large-scale designs and complex state machines.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to store buffers, FIFOs, and local datasets without external memory dependencies.
  • I/O Density  840 user I/Os enable broad connectivity for multi-channel interfaces, parallel buses, and dense peripheral integration.
  • Power Supply  Operates from a core voltage range of 820 mV to 880 mV, allowing designers to plan power distribution and regulator selection precisely.
  • Package and Mounting  Offered in a 1932-BBGA (FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type supports standard PCB assembly processes.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial and controlled-environment deployments.
  • Regulatory Compliance  RoHS compliant for lead-free manufacturing and environmental stewardship.

Typical Applications

  • High-density Data Processing  Large logic and memory resources make this device suitable for packet processing, pattern matching, and inline data manipulation tasks.
  • Communications Infrastructure  High I/O count and dense logic enable aggregation, timing, and control functions in networking and telecom equipment.
  • Advanced Embedded Systems  Consolidate multiple control and signal-processing functions into a single FPGA for instrumentation, test equipment, and compute modules.

Unique Advantages

  • Substantial Logic Integration:  952,000 logic elements reduce the need for multiple devices, simplifying board layout and lowering BOM complexity.
  • Large On-Chip Memory:  Approximately 53.25 Mbits of embedded RAM supports deep buffering and local data storage, minimizing external memory traffic.
  • High I/O Count:  840 I/Os provide flexibility for multi-channel interfaces and dense peripheral connectivity without multiplexing compromises.
  • Surface-Mount, High-Density Package:  1932-ball FCBGA package enables compact PCB designs while supporting standard SMT assembly workflows.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream commercial deployments with established thermal management.

Why Choose 5SEEBF45C3G?

The 5SEEBF45C3G positions itself as a high-capacity Stratix V E FPGA for designers needing substantial logic, memory, and I/O in a single, surface-mount package. Its combination of 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 840 I/Os supports consolidation of complex system functions, enabling streamlined board designs and reduced system-level component count.

This device is well suited to teams building high-density communications, data-processing, and advanced embedded products that require commercial temperature operation and RoHS compliance. Its package and power specifications allow engineering teams to plan PCB layout, power delivery, and thermal considerations with precision.

Request a quote or submit a purchase inquiry to evaluate 5SEEBF45C3G for your next high-density FPGA implementation.

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