5SGSMD5K1F40C2L

The 5SGSMD5K1F40C2L is an Intel Stratix V GS Field Programmable Gate Array (FPGA) in a 1517-BBGA (1517-FBGA, 40×40) package designed for DSP-centric, transceiver-enabled applications. Built on a 28‑nm process, this commercial-grade, surface-mount device combines high logic density with abundant embedded memory and high‑speed transceiver capability to address data‑intensive designs.

Key use cases include high-performance digital signal processing, backplane and optical-interface systems, and bandwidth‑centric networking equipment where large logic capacity, on‑chip RAM, and integrated transceivers are required.

Key Features

• Core Architecture 28‑nm TSMC process technology with a Stratix V GS architecture featuring adaptive logic modules and an enhanced fabric for high-throughput designs.
• Logic Capacity 457,000 logic elements suitable for complex FPGA designs and large-scale integration of custom logic.
• Embedded Memory Approximately 39.94 Mbits of on‑chip RAM provided by M20K memory blocks for large buffering, packet processing, and data staging.
• Variable‑Precision DSP Resources GS variant supports abundant DSP resources, including up to 3,926 18×18 or 1,963 27×27 multipliers for high‑precision signal processing and algorithm acceleration.
• Integrated Transceivers GS devices include integrated transceivers with 14.1 Gbps capability for high‑speed serial links used in backplane and optical interfaces.
• I/O and Packaging 696 user I/Os in a 1517‑FBGA (40×40) ball‑grid package; surface‑mount for compact board layouts.
• Power and Voltage Core supply operating range 820 mV to 880 mV to match system power requirements.
• Clocking and Reliability On‑chip fractional PLLs and a comprehensive fabric clocking network support precise timing and multi‑domain designs.
• Commercial Grade & Compliance Commercial operating temperature range 0 °C to 85 °C and RoHS‑compliant construction.

Typical Applications

• High‑Performance DSP Systems Deploy variable‑precision DSP blocks and large multiplier arrays for signal filtering, FFTs, and real‑time processing.
• Optical and Backplane Interfaces Use integrated 14.1 Gbps transceivers for high‑speed serial links in optical transport, network aggregation, and switch fabrics.
• Network and Packet Processing Leverage large logic density and ample on‑chip RAM for packet buffering, traffic management, and protocol offload tasks.
• Broadcast and Military Communications Implement complex modulation, encoding, and multi‑channel processing where DSP throughput and transceiver bandwidth are critical.

Unique Advantages

• High Logic Density: 457,000 logic elements enable consolidation of large custom logic blocks and system functions into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Approximately 39.94 Mbits of embedded RAM supports deep buffering and high‑throughput data paths without external memory dependency.
• Optimized DSP Resources: Dedicated DSP multipliers and ALM architecture accelerate computation‑heavy functions, shortening development time for signal processing algorithms.
• Integrated High‑Speed SerDes: 14.1 Gbps transceiver capability simplifies high‑bandwidth link implementation for backplane and optical interfaces.
• Robust Clocking: Fractional PLLs and fabric clocking support multiple clock domains and precise timing requirements in complex systems.
• Commercial‑Grade, RoHS‑Compliant: Designed for commercial temperature ranges with RoHS compliance for broad deployment in mainstream products.

Why Choose 5SGSMD5K1F40C2L?

The 5SGSMD5K1F40C2L combines high logic capacity, substantial embedded memory, dedicated DSP resources, and integrated transceivers in a single Stratix V GS device—making it well suited for designers building data‑intensive, DSP‑centric, and high‑bandwidth systems. Its 1517‑FBGA package and surface‑mount form factor support compact, production‑ready board designs.

This device is ideal for engineering teams that require scalable FPGA resources and integrated high‑speed I/O to reduce external component count and accelerate time to market, while operating within a commercial temperature envelope.

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