5SGSMD5K2F40C1N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,155 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K2F40C1N – Stratix V GS FPGA, 457,000 logic elements, 696 I/O, 1517-BBGA
The 5SGSMD5K2F40C1N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1517-ball FCBGA package. Built on a 28‑nm process, this GS‑variant device is architected for DSP‑centric, transceiver‑based applications requiring high logic density, abundant embedded memory, and extensive I/O.
This device targets bandwidth- and compute-intensive markets such as wireline communications, broadcast, and high‑performance computing where integrated transceivers, variable‑precision DSP resources, and large on‑chip memory accelerate signal processing and protocol handling.
Key Features
- Core architecture: 28‑nm Stratix V architecture with redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network for high‑performance logic implementation.
- Logic capacity: Approximately 457,000 logic elements, providing a large fabric for complex system integration and custom logic functions.
- Embedded memory: Approximately 39.9 Mbits of on‑chip RAM (Total Ram Bits: 39,936,000) using 20 Kbit (M20K) memory blocks for packet buffering, LUTs, and scratchpad storage.
- DSP resources: Variable‑precision DSP blocks optimized for high‑precision digital signal processing workloads; GS family devices support large multiplier counts suited to DSP‑centric designs.
- High‑speed transceivers: Integrated transceivers with 14.1‑Gbps data‑rate capability (GS family), enabling backplane and optical interface implementations for high‑bandwidth links.
- I/O density: 696 user I/O pins to support wide parallel interfaces, multiple high‑speed lanes, and flexible board routing.
- Power and operating range: Core voltage range 870 mV to 930 mV; commercial operating temperature range 0 °C to 85 °C.
- Package: 1517‑BBGA FCBGA (supplier device package: 1517‑FBGA 40×40) for high‑density board integration using surface‑mount assembly.
- Embedded Hard IP and system blocks: Fractional PLLs and an Embedded HardCopy® block for hardened IP instantiation and protocol offload options.
- Compliance: RoHS‑compliant construction.
Typical Applications
- High‑performance DSP systems: Implement complex signal processing algorithms using the device’s variable‑precision DSP blocks and large multiplier resources.
- Networking and packet processing: Use integrated transceivers and abundant on‑chip memory to implement backplane interfaces, packet buffering, and traffic management functions.
- Broadcast and optical transport: Support 40G/100G class interfaces and optical transport protocols with high‑speed transceivers and large logic fabric for protocol handling.
- Computing accelerators: Offload compute kernels and specialized processing pipelines using dense logic, DSP resources, and high I/O bandwidth.
Unique Advantages
- High logic and memory density: Approximately 457,000 logic elements and ~39.9 Mbits of embedded RAM enable integration of large functions and deep buffering on a single device, reducing external memory dependencies.
- DSP‑focused architecture: Variable‑precision DSP blocks and a high multiplier count provide the arithmetic performance required for demanding signal processing tasks.
- Integrated high‑speed transceivers: 14.1‑Gbps transceiver capability simplifies implementation of serial links and optical interfaces without separate PHY components.
- Rich I/O complement: 696 I/O pins facilitate multi‑lane interfaces and parallel data paths, improving system throughput and board design flexibility.
- System integration blocks: Fractional PLLs and Embedded HardCopy capability accelerate protocol implementation and offer a migration path for production designs.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS‑compliant, suitable for commercial applications and standard manufacturing flows.
Why Choose 5SGSMD5K2F40C1N?
The 5SGSMD5K2F40C1N combines a high logic count, substantial embedded memory, abundant DSP resources, and integrated high‑speed transceivers in a single Stratix V GS device. This combination makes it well suited to designers building transceiver‑centric, DSP‑heavy systems that require on‑chip bandwidth and compute density.
Its 1517‑ball FCBGA package and 696 I/O pins enable dense board-level integration while the device’s architecture and system blocks support efficient implementation of high‑bandwidth protocols and signal processing pipelines. For commercial designs requiring scalable performance and a robust FPGA ecosystem, this Stratix V GS device offers a clear hardware foundation.
Request a quote or contact sales to discuss availability, pricing, and technical support for the 5SGSMD5K2F40C1N.

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