5SGSMD5K2F40C1N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA

Quantity 1,155 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs172600Number of Logic Elements/Cells457000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits39936000

Overview of 5SGSMD5K2F40C1N – Stratix V GS FPGA, 457,000 logic elements, 696 I/O, 1517-BBGA

The 5SGSMD5K2F40C1N is an Intel Stratix® V GS field-programmable gate array (FPGA) in a 1517-ball FCBGA package. Built on a 28‑nm process, this GS‑variant device is architected for DSP‑centric, transceiver‑based applications requiring high logic density, abundant embedded memory, and extensive I/O.

This device targets bandwidth- and compute-intensive markets such as wireline communications, broadcast, and high‑performance computing where integrated transceivers, variable‑precision DSP resources, and large on‑chip memory accelerate signal processing and protocol handling.

Key Features

  • Core architecture: 28‑nm Stratix V architecture with redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network for high‑performance logic implementation.
  • Logic capacity: Approximately 457,000 logic elements, providing a large fabric for complex system integration and custom logic functions.
  • Embedded memory: Approximately 39.9 Mbits of on‑chip RAM (Total Ram Bits: 39,936,000) using 20 Kbit (M20K) memory blocks for packet buffering, LUTs, and scratchpad storage.
  • DSP resources: Variable‑precision DSP blocks optimized for high‑precision digital signal processing workloads; GS family devices support large multiplier counts suited to DSP‑centric designs.
  • High‑speed transceivers: Integrated transceivers with 14.1‑Gbps data‑rate capability (GS family), enabling backplane and optical interface implementations for high‑bandwidth links.
  • I/O density: 696 user I/O pins to support wide parallel interfaces, multiple high‑speed lanes, and flexible board routing.
  • Power and operating range: Core voltage range 870 mV to 930 mV; commercial operating temperature range 0 °C to 85 °C.
  • Package: 1517‑BBGA FCBGA (supplier device package: 1517‑FBGA 40×40) for high‑density board integration using surface‑mount assembly.
  • Embedded Hard IP and system blocks: Fractional PLLs and an Embedded HardCopy® block for hardened IP instantiation and protocol offload options.
  • Compliance: RoHS‑compliant construction.

Typical Applications

  • High‑performance DSP systems: Implement complex signal processing algorithms using the device’s variable‑precision DSP blocks and large multiplier resources.
  • Networking and packet processing: Use integrated transceivers and abundant on‑chip memory to implement backplane interfaces, packet buffering, and traffic management functions.
  • Broadcast and optical transport: Support 40G/100G class interfaces and optical transport protocols with high‑speed transceivers and large logic fabric for protocol handling.
  • Computing accelerators: Offload compute kernels and specialized processing pipelines using dense logic, DSP resources, and high I/O bandwidth.

Unique Advantages

  • High logic and memory density: Approximately 457,000 logic elements and ~39.9 Mbits of embedded RAM enable integration of large functions and deep buffering on a single device, reducing external memory dependencies.
  • DSP‑focused architecture: Variable‑precision DSP blocks and a high multiplier count provide the arithmetic performance required for demanding signal processing tasks.
  • Integrated high‑speed transceivers: 14.1‑Gbps transceiver capability simplifies implementation of serial links and optical interfaces without separate PHY components.
  • Rich I/O complement: 696 I/O pins facilitate multi‑lane interfaces and parallel data paths, improving system throughput and board design flexibility.
  • System integration blocks: Fractional PLLs and Embedded HardCopy capability accelerate protocol implementation and offer a migration path for production designs.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS‑compliant, suitable for commercial applications and standard manufacturing flows.

Why Choose 5SGSMD5K2F40C1N?

The 5SGSMD5K2F40C1N combines a high logic count, substantial embedded memory, abundant DSP resources, and integrated high‑speed transceivers in a single Stratix V GS device. This combination makes it well suited to designers building transceiver‑centric, DSP‑heavy systems that require on‑chip bandwidth and compute density.

Its 1517‑ball FCBGA package and 696 I/O pins enable dense board-level integration while the device’s architecture and system blocks support efficient implementation of high‑bandwidth protocols and signal processing pipelines. For commercial designs requiring scalable performance and a robust FPGA ecosystem, this Stratix V GS device offers a clear hardware foundation.

Request a quote or contact sales to discuss availability, pricing, and technical support for the 5SGSMD5K2F40C1N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up