5SGSMD5K2F40C2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,120 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 172600 | Number of Logic Elements/Cells | 457000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 39936000 |
Overview of 5SGSMD5K2F40C2LG – Stratix® V GS Field Programmable Gate Array (FPGA)
The 5SGSMD5K2F40C2LG is a commercial-grade Stratix® V GS FPGA from Intel, offered in a 1517-BBGA FCBGA package. It delivers high logic capacity and on-chip memory combined with a large I/O count for dense, system-level programmable logic implementations.
Key device-level electrical parameters include a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C. Detailed electrical and switching characteristics for the Stratix V family are documented in the device datasheet.
Key Features
- Core logic: 457,000 logic elements (logic element cells) for high-density programmable logic and complex design implementation.
- Embedded memory: Approximately 39.94 Mbits of on-chip RAM to support large data buffers and local storage without external memory.
- I/O capacity: 696 user I/O pins to support wide bus interfaces and high-pin-count system connections.
- Power supply: Core voltage supply specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
- Package and mounting: 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device.
- Operating grade and temperature: Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards compliance: RoHS compliant.
Typical Applications
- High-density programmable logic systems: Use where substantial logic capacity (457,000 logic elements) is required to implement complex algorithms or custom hardware accelerators.
- On-chip data buffering and local memory: Designs that benefit from approximately 39.94 Mbits of embedded RAM for intermediate storage and high-throughput data handling.
- I/O-intensive designs: Systems that require a large number of external connections leverage the 696 I/O pins for broad interfacing and parallel data paths.
Unique Advantages
- High logic capacity: 457,000 logic element cells enable implementation of large-scale programmable logic and complex system functions on a single device.
- Substantial embedded memory: Approximately 39.94 Mbits of on-chip RAM reduces dependency on external memory for many applications.
- Extensive I/O footprint: 696 I/O pins provide flexibility for wide buses, multiple interfaces, and high-pin-count designs.
- Compact FCBGA packaging: 1517-BBGA package and 1517-FBGA (40×40) supplier package enable dense board-level integration with surface-mount assembly.
- Defined low-voltage core operation: Core supply range of 820 mV–880 mV supports power-aware design and predictable core power characteristics.
- Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial-temperature deployments.
Why Choose 5SGSMD5K2F40C2LG?
The 5SGSMD5K2F40C2LG positions itself as a high-capacity, commercially graded Stratix V GS FPGA for designs that require large programmable logic resources, significant on-chip memory, and a high I/O count in a compact FCBGA package. Its documented electrical characteristics and manufacturer datasheet support informed integration into system designs.
This device is suited to teams and projects prioritizing integration density and on-chip resources, offering a clear specification set—logic elements, embedded RAM, I/O count, package, and operating conditions—that supports scalable design decisions and predictable system behavior.
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