5SGSMD5K2F40I2L

The 5SGSMD5K2F40I2L is an Intel Stratix® V GS field programmable gate array built on a 28‑nm process. As a GS‑variant device, it targets DSP‑centric, transceiver‑based applications with a combination of high logic density, abundant embedded memory, and integrated transceiver capability.

This industrial‑grade, surface‑mount FCBGA package offers a high I/O count and a wide operating range, delivering the on‑chip resources required for high‑performance signal processing, networking, and compute‑intensive designs.

Key Features

• Core Architecture Stratix V family device architecture with redesigned adaptive logic modules (ALMs) and multi‑track routing.
• Logic Capacity 457,000 logic elements suitable for large, complex FPGA designs.
• Embedded Memory Approximately 39.9 Mbits of on‑chip RAM implemented with 20‑Kbit (M20K) embedded memory blocks.
• DSP Resources GS‑variant supports abundant variable‑precision DSP blocks for high‑precision and high‑throughput DSP implementations (family data cites support for up to 3,926 18×18 or 1,963 27×27 multipliers).
• High Pin‑Count I/O 696 I/O pins to support wide parallel interfaces and high channel counts.
• Integrated Transceivers (Family) Stratix V GS devices include integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces (family level).
• Power Supply Core voltage range: 820 mV to 880 mV.
• Package & Mounting 1517‑BBGA (FCBGA) supplier package 1517‑FBGA (40×40), surface‑mount assembly.
• Operating Temperature Industrial range: −40 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Transceiver‑based DSP Systems — Implement high‑precision, variable‑precision DSP pipelines and multichannel signal processing using the abundant DSP blocks and on‑chip RAM.
• High‑Bandwidth Networking — Support 40G/100G class transport and packet processing implementations that require dense logic, large RAM, and integrated transceiver capability.
• Broadcast and Military Communications — Deploy in systems that need high channel counts and deterministic DSP performance across an industrial temperature range.
• ASIC Prototyping and Migration — Prototype production designs on Stratix V FPGAs with a documented low‑risk path to HardCopy® V ASICs for higher‑volume production (family‑level flow).

Unique Advantages

• High Logic Density: 457,000 logic elements provide capacity for large, complex algorithms and multi‑function systems on a single device.
• Significant On‑Chip Memory: Approximately 39.9 Mbits of embedded memory reduces external RAM dependency and improves bandwidth and latency for data‑intensive workloads.
• Extensive I/O Count: 696 I/O pins enable broad parallel interfacing and high channel connectivity for board‑level integration.
• DSP‑Oriented Resources: Variable‑precision DSP blocks and family‑documented multiplier counts support compute‑heavy signal processing tasks.
• Industrial Thermal Range: −40 °C to 100 °C supports deployment in thermally demanding environments.
• RoHS Compliant Package: FCBGA 1517 package in a surface‑mount form factor for high‑pin‑count board designs while meeting RoHS requirements.

Why Choose 5SGSMD5K2F40I2L?

The 5SGSMD5K2F40I2L combines large logic capacity, substantial on‑chip memory, and DSP‑focused resources within an industrial‑grade Stratix V GS device. These characteristics make it well suited for designs that need dense compute resources, multi‑channel I/O, and integrated transceiver capability at the device family level.

For projects that anticipate migration to ASIC for production, Stratix V devices offer a documented prototyping path to HardCopy® V ASICs, enabling design scalability from development through higher‑volume production. The device’s voltage, thermal, and package specifications provide clear integration parameters for engineering and procurement teams.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for the 5SGSMD5K2F40I2L.