5SGTMC5K3F40C1

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 46080000 425000 1517-BBGA, FCBGA

Quantity 505 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160500Number of Logic Elements/Cells425000
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits46080000

Overview of 5SGTMC5K3F40C1 – Stratix® V GT Field Programmable Gate Array (FPGA) IC, 600 I/O

The 5SGTMC5K3F40C1 is a Stratix® V GT field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA/FCBGA (1517-FBGA, 40×40) surface-mount package. It delivers large programmable logic capacity, substantial on‑chip memory, and extensive I/O capability suitable for demanding commercial applications.

With approximately 425,000 logic elements, roughly 46 Mbits of embedded memory, dedicated DSP/multiplier resources, and broad clocking resources, this device is targeted at designers who need high-density programmable logic, abundant I/O, and integrated signal-processing building blocks within a commercial temperature range.

Key Features

  • Programmable Logic  Approximately 425,000 logic elements and 641,600 registers provide significant capacity for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and partitioned memory structures for data‑intensive designs.
  • DSP and Multiplier Resources  256 hardened 18×18 multipliers and 256 hardened single‑precision floating‑point multipliers/adders for efficient arithmetic and signal‑processing operations.
  • I/O and SERDES Resources  600 GPIOs available on this package, with the device supporting up to 776 maximum user I/O pins and up to 150 LVDS channels per the device data; suitable for wide parallel interfaces and high‑speed differential signaling.
  • Clocking and Timing  16 global clocks, 92 regional clocks and 28 PLLs enable flexible clock distribution, multiple clock domains, and precise timing control.
  • Package and Power  1517‑BBGA FCBGA package (1517‑FBGA 40×40) in a surface‑mount form factor; operating supply range specified at 870 mV to 930 mV.
  • Operating Range and Compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Typical Applications

  • Communications and Networking  Implement protocol engines, packet processing, and interface bridging using extensive I/O, LVDS capability, and abundant logic resources.
  • High‑Performance Signal Processing  Use the device's large DSP and multiplier resources together with substantial on‑chip RAM for real‑time filtering, FFTs, and compute kernels.
  • Custom Hardware Acceleration  Deploy application‑specific accelerators and data‑path offloads where high logic capacity and significant memory bandwidth are required.
  • Prototyping and Complex System Integration  Integrate multiple interfaces, control logic, and processing blocks into a single FPGA for system‑level prototyping and integration.

Unique Advantages

  • High Logic Density: Approximately 425,000 logic elements and 641,600 registers enable consolidation of large designs into a single device.
  • Substantial Embedded Memory: Around 46 Mbits of on‑chip RAM reduces external memory dependence and supports buffering and large state machines.
  • Robust DSP Capability: 256 18×18 multipliers plus 256 hardened single‑precision floating‑point multipliers/adders accelerate arithmetic‑intensive tasks with dedicated silicon resources.
  • Extensive I/O and Clocking: 600 GPIOs (with up to 776 user I/O pins supported per device data), up to 150 LVDS channels, 16 global and 92 regional clocks, and 28 PLLs provide interface and timing flexibility.
  • Compact, Surface‑Mount Package: 1517‑BBGA (1517‑FBGA 40×40) package balances high pin count with a compact footprint for board‑level integration.
  • Commercial‑Grade Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGTMC5K3F40C1?

The 5SGTMC5K3F40C1 combines large programmable logic capacity, significant embedded memory, dedicated DSP resources, and broad I/O capability in a single Stratix® V GT FPGA package from Intel. Its specification set is well suited to commercial designs that demand on‑chip compute, memory, and I/O integration without partitioning across multiple devices.

Choose this part when your design requires consolidation of complex logic, real‑time signal processing, and extensive interfacing into a compact surface‑mount FPGA solution backed by published technical documentation from the manufacturer.

Request a quote or submit a pricing request for 5SGTMC5K3F40C1 to start your procurement or evaluation process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up