5SGTMC5K3F40C1
| Part Description |
Stratix® V GT Field Programmable Gate Array (FPGA) IC 600 46080000 425000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 505 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160500 | Number of Logic Elements/Cells | 425000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGTMC5K3F40C1 – Stratix® V GT Field Programmable Gate Array (FPGA) IC, 600 I/O
The 5SGTMC5K3F40C1 is a Stratix® V GT field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA/FCBGA (1517-FBGA, 40×40) surface-mount package. It delivers large programmable logic capacity, substantial on‑chip memory, and extensive I/O capability suitable for demanding commercial applications.
With approximately 425,000 logic elements, roughly 46 Mbits of embedded memory, dedicated DSP/multiplier resources, and broad clocking resources, this device is targeted at designers who need high-density programmable logic, abundant I/O, and integrated signal-processing building blocks within a commercial temperature range.
Key Features
- Programmable Logic Approximately 425,000 logic elements and 641,600 registers provide significant capacity for complex combinational and sequential logic implementations.
- Embedded Memory Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and partitioned memory structures for data‑intensive designs.
- DSP and Multiplier Resources 256 hardened 18×18 multipliers and 256 hardened single‑precision floating‑point multipliers/adders for efficient arithmetic and signal‑processing operations.
- I/O and SERDES Resources 600 GPIOs available on this package, with the device supporting up to 776 maximum user I/O pins and up to 150 LVDS channels per the device data; suitable for wide parallel interfaces and high‑speed differential signaling.
- Clocking and Timing 16 global clocks, 92 regional clocks and 28 PLLs enable flexible clock distribution, multiple clock domains, and precise timing control.
- Package and Power 1517‑BBGA FCBGA package (1517‑FBGA 40×40) in a surface‑mount form factor; operating supply range specified at 870 mV to 930 mV.
- Operating Range and Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.
Typical Applications
- Communications and Networking Implement protocol engines, packet processing, and interface bridging using extensive I/O, LVDS capability, and abundant logic resources.
- High‑Performance Signal Processing Use the device's large DSP and multiplier resources together with substantial on‑chip RAM for real‑time filtering, FFTs, and compute kernels.
- Custom Hardware Acceleration Deploy application‑specific accelerators and data‑path offloads where high logic capacity and significant memory bandwidth are required.
- Prototyping and Complex System Integration Integrate multiple interfaces, control logic, and processing blocks into a single FPGA for system‑level prototyping and integration.
Unique Advantages
- High Logic Density: Approximately 425,000 logic elements and 641,600 registers enable consolidation of large designs into a single device.
- Substantial Embedded Memory: Around 46 Mbits of on‑chip RAM reduces external memory dependence and supports buffering and large state machines.
- Robust DSP Capability: 256 18×18 multipliers plus 256 hardened single‑precision floating‑point multipliers/adders accelerate arithmetic‑intensive tasks with dedicated silicon resources.
- Extensive I/O and Clocking: 600 GPIOs (with up to 776 user I/O pins supported per device data), up to 150 LVDS channels, 16 global and 92 regional clocks, and 28 PLLs provide interface and timing flexibility.
- Compact, Surface‑Mount Package: 1517‑BBGA (1517‑FBGA 40×40) package balances high pin count with a compact footprint for board‑level integration.
- Commercial‑Grade Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
Why Choose 5SGTMC5K3F40C1?
The 5SGTMC5K3F40C1 combines large programmable logic capacity, significant embedded memory, dedicated DSP resources, and broad I/O capability in a single Stratix® V GT FPGA package from Intel. Its specification set is well suited to commercial designs that demand on‑chip compute, memory, and I/O integration without partitioning across multiple devices.
Choose this part when your design requires consolidation of complex logic, real‑time signal processing, and extensive interfacing into a compact surface‑mount FPGA solution backed by published technical documentation from the manufacturer.
Request a quote or submit a pricing request for 5SGTMC5K3F40C1 to start your procurement or evaluation process.

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