5SGXEA5K2F40C3N

The 5SGXEA5K2F40C3N is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large logic fabric alongside substantial embedded RAM and a high I/O count for designs that require significant on-chip resources.

Built for programmable, high-density logic integration, this commercial-grade device supports a core voltage supply of 820 mV to 880 mV and operates over a 0 °C to 85 °C temperature range. The device is RoHS compliant and supplied in a 1517-FBGA (40×40) surface-mount package.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement complex, resource‑intensive digital designs.
• Logic Structure  185,000 LABs/CLBs reported for mapping and partitioning large designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Capacity  696 general-purpose I/Os to support large parallel interfaces and dense board-level connectivity.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV, enabling targeted low-voltage operation.
• Package and Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor.
• Temperature and Grade  Commercial grade with an operating range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density programmable logic  Use the large logic element count and LAB resources for complex state machines, datapath engines, and control logic integration.
• On‑chip buffering and memory‑intensive functions  Approximately 46.08 Mbits of embedded RAM supports packet buffering, lookup tables, and intermediate data storage.
• Large I/O interfacing  With 696 I/Os, the device is suitable for systems that require multiple parallel buses, wide data paths, or numerous peripheral connections.

Unique Advantages

• High logic density: 490,000 logic elements provide substantial resources to consolidate multiple functions on a single device, reducing system-level component count.
• Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM minimizes external memory dependency for many buffering and storage needs.
• Extensive I/O availability: 696 I/Os enable flexible interfacing to a wide range of peripherals and high‑pin‑count board designs.
• Compact, surface‑mount package: 1517-FBGA (40×40) offers high pin density in a board-friendly BGA footprint.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV supports designs targeting reduced core power at the FPGA level.
• Commercial temperature grade and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial applications.

Why Choose 5SGXEA5K2F40C3N?

The 5SGXEA5K2F40C3N places a large Stratix V GX logic fabric, substantial embedded memory, and broad I/O capability into a single commercial-grade FCBGA package. It is suited to projects that require consolidation of complex digital functions and dense board-level interfaces while maintaining a compact package footprint and low-voltage core operation.

As a member of the Stratix V GX family, this device is documented in the Stratix V Device Datasheet for electrical and switching characteristics relevant to system design. Its combination of logic capacity, embedded RAM, and I/O count makes it a practical choice for engineers and procurement teams targeting high-density FPGA integration.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA5K2F40C3N. Our team will provide the details you need to evaluate this device for your next design.