5SGXMA5K2F40I2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 29 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXMA5K2F40I2LG – Stratix® V GX FPGA, 490,000 logic elements
The 5SGXMA5K2F40I2LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers very high logic density and extensive I/O capability for designs that require large programmable logic capacity and substantial embedded memory.
This device combines a large number of logic elements with a significant amount of on‑chip RAM and a high I/O count, packaged in a 1517‑BBGA (FCBGA) 40×40 footprint and intended for surface‑mount assembly. Targeted design scenarios include applications that need dense logic, wide connectivity, and operation across an industrial temperature range.
Key Features
- Logic Capacity Approximately 490,000 logic elements, enabling implementation of large, complex programmable logic designs.
- Embedded Memory Approximately 46 Mbits of on‑chip RAM (46,080,000 total RAM bits) to support buffers, FIFOs, and memory‑intensive functions.
- I/O Density Up to 696 user I/O pins to support wide parallel interfaces and extensive connectivity to peripherals and subsystems.
- Package & Mounting 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40). Device is surface‑mount for standard PCB assembly flows.
- Power Specified voltage supply range of 820 mV to 880 mV for core operation.
- Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental requirements.
- Family Characteristics Part of the Stratix V GX family; datasheet information for the family describes industrial and commercial speed grade offerings and electrical/switching characteristics relevant to Stratix V devices.
Unique Advantages
- High architectural density: The large logic‑element count supports consolidation of multi‑function designs into a single device, reducing board-level complexity.
- Substantial embedded memory: Approximately 46 Mbits of RAM enables on‑chip buffering and memory‑centric accelerators without immediate reliance on external memory.
- Extensive I/O capability: 696 I/O pins provide the flexibility to interface with numerous external devices, buses, and parallel data paths.
- Industrial temperature rating: Certified operation from −40 °C to 100 °C for applications that require wider ambient ranges.
- Standard FCBGA package: 1517‑BBGA (1517‑FBGA 40×40) surface‑mount package supports compact board layouts while enabling high pin count routing.
- Regulatory readiness: RoHS compliance supports use in products subject to environmental directive requirements.
Why Choose 5SGXMA5K2F40I2LG?
The 5SGXMA5K2F40I2LG positions itself for projects that demand large programmable logic capacity, significant on‑chip memory, and broad I/O connectivity within an industrial temperature envelope. Its Stratix V GX architecture and the provided electrical characteristics (including the specified core supply range and thermal rating) make it suitable for designs that prioritize integration and high‑density implementation.
Choosing this device offers designers a scalable, high‑capacity FPGA option that simplifies system partitioning by consolidating logic and memory resources on a single device, while providing the packaging and I/O needed for complex boards. The device’s compliance and documented family electrical characteristics support predictable implementation and qualification workflows.
Request a quote or submit a sales inquiry to obtain pricing, availability, and delivery information for 5SGXMA5K2F40I2LG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018