A3P125-1TQ144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 100 36864 144-LQFP |
|---|---|
| Quantity | 989 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-1TQ144 – ProASIC3 FPGA, 100 I/O, 36,864-bit RAM, 144-LQFP
The A3P125-1TQ144 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides 3072 logic elements (cells), approximately 36,864 bits of on-chip RAM, and support for 100 general-purpose I/O pins in a compact 144-LQFP package.
Designed for commercial-grade applications, the device operates from a 1.425 V to 1.575 V supply and across a 0 °C to 85 °C temperature range. The A3P125-1TQ144 is RoHS compliant and supplied in a surface-mount 144-TQFP (20×20) footprint.
Key Features
- Core Logic 3072 logic elements (cells) delivering 125,000 gates of programmable logic for implementing combinational and sequential digital functions.
- On-Chip Memory Approximately 36,864 bits of embedded RAM for data buffering, state storage, and small lookup tables.
- I/O Capacity 100 general-purpose I/O pins to interface with peripherals, sensors, and system buses.
- Power Specified operating supply range of 1.425 V to 1.575 V for core power planning and regulator selection.
- Package & Mounting 144-LQFP package (supplier device package: 144-TQFP 20×20) with surface-mount mounting for compact PCB integration.
- Temperature & Grade Commercial grade operation over 0 °C to 85 °C for standard commercial electronics applications.
- Environmental Compliance RoHS compliant to support regulatory and assembly requirements.
Typical Applications
- Embedded control and glue logic Use the device’s logic elements and I/O to implement control state machines, protocol bridging, and system glue in commercial electronic products.
- Prototyping and development Leverage programmable logic and on-chip RAM for validating digital designs and iterating hardware architectures.
- I/O expansion in commercial systems Deploy the A3P125-1TQ144 where additional GPIO and custom interfacing are required within a commercial temperature environment.
Unique Advantages
- Moderate logic density: 3072 logic elements and 125,000 gates provide a balanced capacity for mid-range digital implementations without excessive board area.
- Integrated on-chip memory: Approximately 36,864 bits of RAM reduce the need for external memory in many buffering and LUT applications.
- Generous I/O count: 100 I/O pins simplify peripheral integration and reduce external interface components.
- Compact surface-mount package: 144-LQFP (20×20) footprint facilitates compact board layouts and standard assembly processes.
- Commercial temperature suitability: Rated 0 °C to 85 °C for use in standard commercial products and environments.
- Regulatory compliance: RoHS compliance supports modern environmental and manufacturing requirements.
Why Choose A3P125-1TQ144?
The A3P125-1TQ144 positions itself as a practical ProASIC3 FPGA option for commercial applications that require a moderate amount of programmable logic, on-chip RAM, and a substantial number of I/O signals in a compact surface-mount package. Its specification set — including 3072 logic elements, 36,864 bits of RAM, 100 I/O, and a 1.425 V–1.575 V supply range — makes it well suited to designers seeking integrated logic and interfacing capability without moving to larger device families.
For teams developing commercial embedded products, board-level prototypes, or systems that need flexible digital logic and I/O, the A3P125-1TQ144 offers a balance of capacity, package density, and standard commercial-temperature operation backed by Microchip Technology’s ProASIC3 lineage.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the A3P125-1TQ144.

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