A3P125-1PQ208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 133 36864 208-BFQFP |
|---|---|
| Quantity | 1,168 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 133 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-1PQ208 – ProASIC3 FPGA, 3,072 logic elements, 133 I/O, 208-BFQFP
The A3P125-1PQ208 is a ProASIC3 field programmable gate array (FPGA) offered in a 208-pin BFQFP surface-mount package. It provides medium-density programmable logic with a defined core voltage range and commercial operating temperature, making it suitable for a range of general-purpose embedded designs.
Key on-chip resources include 3,072 logic elements, approximately 36.9 kb of embedded RAM, and 133 user I/O pins, delivering a balance of logic density, on-chip memory and I/O capacity for integration in space-constrained PCB designs.
Key Features
- Core Logic — 3,072 logic elements (3072) and approximately 125,000 gates provide medium-density programmable logic for custom digital functions.
- Embedded Memory — 36,864 bits of on-chip RAM (approximately 36.9 kb) for buffering, small data storage and state machines.
- I/O Capacity — 133 user I/O pins to support multiple external interfaces and peripherals.
- Power — Defined supply voltage range of 1.425 V to 1.575 V to support stable core power planning.
- Package & Mounting — Supplied in a 208-BFQFP (supplier package 208-PQFP, 28×28 mm) surface-mount package for standard PCB assembly.
- Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose applications.
- Environmental Compliance — RoHS compliant for use in RoHS-regulated assemblies.
Unique Advantages
- Medium-density integration: Combines 3,072 logic elements and ~125,000 gates to consolidate discrete logic and reduce BOM count.
- On-chip memory for compact designs: 36,864 bits of embedded RAM enable local buffering and small data storage without external memory components.
- Generous I/O count: 133 user I/O pins offer flexible external connectivity options for peripherals and interfaces.
- Standard package footprint: 208-BFQFP (28×28 mm) surface-mount package facilitates placement in existing PCB layouts and automated assembly processes.
- Commercial temperature range: Rated 0 °C to 85 °C to meet typical commercial deployment requirements.
- RoHS compliant: Supports regulatory requirements for lead-free manufacturing and product distribution.
Why Choose A3P125-1PQ208?
The A3P125-1PQ208 positions itself as a practical medium-density FPGA option for commercial-grade embedded designs that require a balance of logic elements, on-chip RAM and a substantial I/O count within a compact 208-pin BFQFP footprint. Its defined core voltage range and RoHS compliance simplify power design and regulatory considerations for production.
This device is well suited to design teams looking to consolidate discrete logic and small memory functions into a single programmable device while maintaining standard surface-mount assembly compatibility and commercial temperature operation.
Request a quote or submit an inquiry to receive pricing and availability information for the A3P125-1PQ208.

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