A3P125-1PQ208I

The A3P125-1PQ208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a balanced mix of programmable logic, on-chip memory, and I/O density in a 208-BFQFP surface-mount package.

With 3072 logic elements, approximately 36,864 bits of on-chip RAM, and 133 user I/O pins, this device targets designs that require moderate logic capacity, flexible interfacing, and operation across an extended industrial temperature range.

Key Features

• Core Logic  3072 logic elements delivering a total of 125,000 gates for implementing custom combinational and sequential logic functions.
• Embedded Memory  36,864 bits (approximately 0.037 Mbits) of on-chip RAM to support buffering, small lookup tables, and state storage.
• I/O Density  133 user I/O pins suitable for multi‑signal interfaces and parallel connections in compact systems.
• Power Supply  Specified supply voltage range of 1.425 V to 1.575 V for predictable power management and system integration.
• Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) optimized for surface-mount assembly and compact board layouts.
• Industrial Temperature Range  Qualified for operation from -40 °C to 100 °C to meet industrial environmental requirements.
• Compliance  RoHS compliant, supporting environmental and regulatory requirements for electronics manufacturing.

Typical Applications

• Industrial Control  Control logic and interface consolidation in automation equipment where extended temperature range and industrial grading are required.
• Communication Interfaces  Protocol bridging and custom frame processing using available logic and abundant I/O pins for medium‑complexity link implementations.
• Sensor Aggregation  Data collection and pre‑processing from multiple sensors, leveraging on-chip memory and I/O resources for deterministic handling.
• Custom Embedded Logic  Application-specific state machines, glue logic, and peripheral control in compact surface‑mount form factors.

Unique Advantages

• Balanced Logic Density:  3072 logic elements and 125,000 gates provide a mid-range capacity for consolidating discrete components into programmable logic.
• Compact, PCB-Friendly Package:  208-BFQFP surface-mount package (208-PQFP, 28×28) simplifies board layout while exposing 133 user I/Os for flexible connectivity.
• Industrial Reliability:  Rated for -40 °C to 100 °C operation to support deployments in industrial environments.
• Predictable Power Envelope:  Narrow supply voltage specification (1.425 V–1.575 V) aids design of stable power delivery networks.
• Regulatory Compliance:  RoHS compliance supports environmental requirements for modern electronics manufacturing.

Why Choose A3P125-1PQ208I?

The A3P125-1PQ208I positions itself as an industrial-grade programmable logic device that balances logic capacity, on-chip memory, and I/O count in a compact surface-mount package. It is suited to engineers who need a configurable solution for mid-complexity control, interface, and signal processing tasks while maintaining operation across an extended temperature range.

Manufactured by Microchip Technology and supplied in a 208-BFQFP package, this device provides a predictable platform for designs that require scalability, environmental robustness, and straightforward PCB integration.

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