A3P125-1FGG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

Quantity 1,159 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P125-1FGG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

The A3P125-1FGG144 is a commercial-grade Field Programmable Gate Array (FPGA) from Microchip Technology offering a balanced mix of logic capacity, embedded memory and I/O in a compact BGA package. Its architecture provides 3,072 logic elements and roughly 36.9k bits of on-chip RAM, making it suitable for mid-range digital logic, interface consolidation and embedded control applications that require programmable logic with moderate gate density.

Key Features

  • Core Logic  Approximately 125,000 gates implemented as 3,072 logic elements to support a variety of custom digital functions and moderate-complexity designs.
  • Embedded Memory  Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) for small FIFOs, registers and buffering needs within the FPGA fabric.
  • I/O Count  97 user I/O pins provide flexible external connectivity for peripheral interfaces and signal routing.
  • Power Supply  Specified supply range of 1.425 V to 1.575 V to match system power rails and ensure stable device operation.
  • Package & Mounting  144-LBGA (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor to support compact board layouts and automated assembly.
  • Operating Range  Commercial temperature rating from 0 °C to 85 °C for standard commercial applications.
  • Regulatory  RoHS compliant, meeting common environmental and lead-free assembly requirements.

Typical Applications

  • Embedded Systems  Implement control logic, glue logic, and custom datapaths where moderate gate count and on-chip RAM are sufficient.
  • Interface and I/O Aggregation  Consolidate multiple peripheral interfaces and perform signal adaptions using 97 available I/O pins.
  • Prototyping and Development  Evaluate mid-range logic designs and iterate hardware proofs-of-concept in a compact BGA package.
  • Commercial Electronics  Integrate programmable functionality into consumer and commercial products where a commercial temperature grade is appropriate.

Unique Advantages

  • Balanced Logic Density:  Approximately 125k gates and 3,072 logic elements deliver a practical balance between capacity and cost for mid-range designs.
  • On-Chip Memory:  About 36.9k bits of embedded RAM reduce external memory requirements for small buffering and control functions.
  • Compact Packaging:  144-LBGA (13×13 FPBGA) supports space-constrained boards while enabling high pin density for system I/O.
  • Commercial Temperature Rating:  Rated 0 °C to 85 °C for deployments in typical commercial environments.
  • RoHS Compliant:  Meets environmental/assembly requirements for lead‑free production processes.
  • Predictable Power Window:  Clear supply voltage range of 1.425 V to 1.575 V simplifies power-supply design and verification.

Why Choose A3P125-1FGG144?

The A3P125-1FGG144 positions itself as a practical, commercially graded FPGA for engineers needing a mid-range programmable logic device with clear, verifiable specifications. Its combination of 3,072 logic elements, approximately 36.9k bits of embedded RAM, and 97 I/O pins in a 144-LBGA package supports compact, cost-conscious designs that require on-board programmable logic and moderate memory resources.

Designed and supplied by Microchip Technology, this device is suited for teams implementing embedded control, interface aggregation or prototype systems where predictable electrical, thermal and package characteristics matter. Its RoHS compliance and surface-mount BGA form factor align with modern assembly and environmental requirements.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the A3P125-1FGG144. Our team can provide commercial purchasing details and support for your design evaluation.

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