A3P125-1FG144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 198 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-1FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/Os, 36,864-bit RAM, 144-LBGA
The A3P125-1FG144 is a ProASIC3 FPGA from Microchip Technology that integrates 3,072 logic elements and 36,864 bits of on-chip RAM in a compact 144-LBGA package. It targets commercial embedded designs and consumer electronics where a moderate density of programmable logic, on-chip memory, and flexible I/O are required.
With 97 user I/Os, a defined supply voltage range, and a commercial operating temperature rating, this device is suited to space-constrained designs that require a reliable, surface-mount FPGA solution from a recognized manufacturer.
Key Features
- Logic Density — 3,072 logic elements (cells) providing programmable logic capacity for glue logic, state machines, and moderate-complexity functions.
- On-Chip Memory — 36,864 bits of embedded RAM for FIFOs, small buffers, and parameter storage within the FPGA fabric.
- I/O — 97 general-purpose I/Os to support interfacing with sensors, peripherals, memory, and other system components.
- Package — 144-LBGA package (supplier device package: 144-FPBGA, 13×13) optimized for compact PCB designs and high-density routing.
- Power — Defined supply voltage range of 1.425 V to 1.575 V for consistent power planning and supply design.
- Thermal & Grade — Commercial operating temperature range of 0 °C to 85 °C and commercial-grade qualification for typical business and consumer applications.
- Mounting — Surface-mount device suitable for modern automated PCB assembly processes.
- Compliance — RoHS compliant, supporting regulatory requirements for many commercial product lines.
Typical Applications
- Embedded Control — Implement control logic and state machines for consumer and commercial embedded systems using available logic elements and on-chip RAM.
- Peripheral and Sensor Interfaces — Use the 97 I/Os to aggregate signals from sensors, ADCs/DACs, and communication peripherals for protocol conversion or preprocessing.
- Prototyping and Development — Rapidly validate hardware logic and custom functions in a compact package suitable for development boards and evaluation modules.
- User Interface Control — Drive and manage display controllers, input scanning, and local UI logic within commercial applications.
Unique Advantages
- Compact, integrated solution: Combines 3,072 logic elements, 36,864 bits of RAM, and 97 I/Os in a single 144-LBGA package to reduce BOM and PCB area.
- Predictable power requirements: Narrow supply voltage range (1.425 V–1.575 V) simplifies power-supply selection and decoupling strategy.
- Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial applications, matching many consumer and business product needs.
- Surface-mount packaging: 144-FPBGA (13×13) supplier package facilitates automated assembly and compact board-level integration.
- RoHS compliance: Meets common regulatory requirements for lead-free manufacturing and distribution in commercial markets.
Why Choose A3P125-1FG144?
The A3P125-1FG144 delivers a balanced mix of logic capacity, embedded memory, and I/O in a compact BGA package from Microchip Technology. Its combination of 3,072 logic elements, 36,864 bits of RAM, and 97 I/Os makes it a practical choice for commercial embedded designs that need on-chip programmability without excessive board space.
This device is well suited to engineering teams and product designers seeking a commercially rated FPGA with defined power and thermal characteristics, RoHS compliance, and a compact supplier package for efficient PCB integration and assembly.
Request a quote or submit an inquiry to receive pricing and availability information for the A3P125-1FG144. Our team can provide lead-time details and help match the device to your project requirements.

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