A3P1000L-FGG144I

The A3P1000L-FGG144I is a ProASIC3L Field Programmable Gate Array (FPGA) IC providing 24,576 logic elements, approximately 147,456 bits of embedded memory, 97 user I/Os and a logic capacity of about 1,000,000 gates in a 144-LBGA surface-mount package.

Rated for industrial operation with an operating temperature range of −40 °C to 100 °C and a supply voltage window of 1.14 V to 1.575 V, this RoHS-compliant device is targeted where mid-density programmable logic, compact packaging and defined power/thermal characteristics are required.

Key Features

• Core Logic  24,576 logic elements providing capacity for approximately 1,000,000 gates of programmable logic.
• Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage and small data structures.
• I/O Count  97 user I/Os to interface with peripherals, sensors and system buses.
• Power  Supported supply voltage range of 1.14 V to 1.575 V for predictable power planning.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Industrial-grade operation from −40 °C to 100 °C for deployment in harsh environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Implement control and interface logic using the device’s industrial temperature rating, 97 I/Os and mid-range logic capacity.
• Embedded system glue logic  Use the 24,576 logic elements and on-chip RAM for protocol adaptation, peripheral bridging and custom control logic.
• Small buffering and state machines  Approximately 0.147 Mbits of embedded memory supports small data buffers and finite-state implementations within compact designs.

Unique Advantages

• Mid-density integration: 24,576 logic elements and ~1,000,000 gates deliver a balance of integration and flexibility for mid-range FPGA designs.
• Compact, industry-standard package: 144-LBGA (13×13) surface-mount package enables high-density board layouts and conservative PCB area usage.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Defined power envelope: Operates across 1.14 V to 1.575 V to support consistent power budgeting and system design.
• On-chip memory reduces BOM: Approximately 0.147 Mbits of RAM reduces the need for small external memory components for buffering and state storage.
• RoHS compliant: Meets lead-free and hazardous substance requirements where RoHS compliance is required.

Why Choose A3P1000L-FGG144I?

The A3P1000L-FGG144I combines a mid-density logic fabric, on-chip embedded memory and a robust 97 I/O count in a compact 144-LBGA surface-mount package, delivering a practical balance of integration and predictability for industrial applications. Its defined supply range and industrial temperature rating make it suitable for designs that require reliable operation across a broad thermal range.

This device is well suited for engineers building industrial control, embedded interface, or mid-density programmable logic solutions that benefit from on-chip resources, a compact package footprint and RoHS compliance.

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