A3P1000L-FGG256

The A3P1000L-FGG256 is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology. It delivers a substantial logic fabric with 24,576 logic elements and roughly 1,000,000 gates in a compact 256-LBGA package, making it suitable for embedded designs that require on-chip programmable logic and flexible I/O.

This device targets commercial-grade applications where a combination of density, I/O count and a defined power/temperature envelope are required. Key specification highlights include 177 user I/O, approximately 0.15 Mbits of embedded memory, and a supply voltage range of 1.14 V to 1.575 V.

Key Features

• Logic Capacity  24,576 logic elements (LEs) providing approximately 1,000,000 gates for implementing custom logic, state machines and glue logic.
• Embedded Memory  Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for data buffering, FIFOs and small lookup tables.
• I/O  177 general-purpose I/O pins to support wide-ranging peripheral interfacing and parallel/serial connectivity needs.
• Power  Designed for operation from a supply voltage between 1.14 V and 1.575 V, allowing compatibility with common low-voltage system rails.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact board-level integration.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental  RoHS compliant.

Typical Applications

• Embedded control and glue logic  Use the device to implement custom control functions and interface glue between processors and peripherals, leveraging 24,576 logic elements and abundant I/O.
• Custom I/O expansion  177 I/O pins enable direct connection to sensors, actuators, and external ICs for board-level I/O consolidation.
• Data buffering and small-memory accelerators  Approximately 0.15 Mbits of embedded RAM supports temporary data storage, FIFOs and small on-chip buffers for deterministic data paths.

Unique Advantages

• High logic density: 24,576 logic elements and about 1,000,000 gates provide substantial on-chip resources for medium-complexity designs without external logic.
• Generous I/O count: 177 user I/O pins reduce the need for external multiplexers or GPIO expanders in I/O-heavy applications.
• Compact board footprint: 256-LBGA (17×17 FPBGA) package enables high-density PCB layouts while keeping mounting straightforward with surface-mount assembly.
• Defined commercial operating envelope: Rated for 0 °C to 85 °C and commercial grade use, making device selection transparent for standard commercial products.
• RoHS compliant: Conforms to environmental regulations for lead-free manufacturing.
• Predictable supply requirements: Operates from a 1.14 V to 1.575 V supply, allowing clear power-rail planning in system designs.

Why Choose A3P1000L-FGG256?

The A3P1000L-FGG256 positions itself as a mid-density, commercial-grade FPGA option from Microchip Technology that balances logic capacity, I/O flexibility and a compact package. Its combination of 24,576 logic elements, substantial I/O availability and on-chip RAM makes it well suited for embedded systems, board-level I/O consolidation and custom hardware acceleration tasks where those specific resources are required.

Choosing this device supports designs that need a clearly defined operating and supply envelope, RoHS compliance, and a compact package for space-constrained PCBs. It is a practical option for engineering teams looking to integrate programmable logic into commercial products backed by Microchip Technology.

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