A3P1000L-FGG256I

The A3P1000L-FGG256I is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a balance of logic capacity, on-chip RAM, and I/O density in a compact 256-LBGA (17×17) surface-mount package.

With 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 177 user I/Os, this device targets designs that require moderate gate density and flexible interfacing within an industrial temperature range.

Key Features

• Logic Capacity 24,576 logic elements and 1,000,000 gates provide substantial programmable logic resources for mid-range FPGA designs.
• Embedded Memory 147,456 total RAM bits (≈0.147 Mbits) for on-chip buffering, state storage, and small lookup tables.
• I/O Density 177 user I/Os to support multiple interfaces and signal routing in a single device.
• Power Operates from a 1.14 V to 1.575 V supply range to match system power rails and design constraints.
• Package and Mounting 256-LBGA (17×17) supplier device package in a surface-mount form factor for compact PCB layouts.
• Temperature and Grade Industrial grade device rated for operation from −40°C to 100°C for robust performance in demanding environments.
• Compliance RoHS compliant to support regulated manufacturing and assembly requirements.

Typical Applications

• Industrial Control Use the device’s logic density and wide operating temperature range for motor control, PLC functions, and automation interfaces.
• Embedded I/O Expansion Leverage 177 I/Os to consolidate multiple peripheral interfaces and reduce system component count.
• Signal Conditioning and Glue Logic Implement custom protocol bridges, timing adapters, and signal conditioning logic using available gates and logic elements.

Unique Advantages

• Substantial Logic Resources: 24,576 logic elements and 1,000,000 gates enable implementation of complex custom logic without external CPLDs or discrete glue logic.
• On-chip RAM for Local Storage: 147,456 bits of embedded RAM provide local buffering and state storage to simplify system memory architecture.
• High I/O Count: 177 user I/Os allow direct interfacing to multiple peripherals and sensors, reducing the need for external expanders.
• Industrial Temperature Range: Rated from −40°C to 100°C to meet environmental demands in industrial deployments.
• Compact LBGA Package: 256-LBGA (17×17) surface-mount package minimizes PCB footprint while delivering ample I/O and routing options.
• RoHS Compliant: Supports environmental and manufacturing requirements for modern electronics production.

Why Choose A3P1000L-FGG256I?

The A3P1000L-FGG256I positions itself as a practical mid-range FPGA offering from Microchip Technology, combining a sizable logic array, measurable embedded RAM, and a high I/O count in a compact industrial-grade package. Its electrical and thermal specifications make it suitable for engineers designing industrial controllers, interface bridges, and embedded systems that require dependable operation across a wide temperature range.

This device is well suited for development teams looking to consolidate logic, reduce external components, and maintain a compact board layout while meeting RoHS requirements and industrial operating conditions.

Request a quote or submit an inquiry to obtain pricing and availability information for the A3P1000L-FGG256I.