A3P125-1FG144T

The A3P125-1FG144T is a ProASIC3 field programmable gate array (FPGA) in a 144-LBGA package. It provides 3,072 logic elements, 36,864 bits of on-chip RAM and up to 97 general-purpose I/O, packaged for surface-mount assembly.

Designed and qualified for automotive use with AEC-Q100 certification and an extended operating temperature range, this device is suited to embedded designs that require a compact, qualified FPGA with clear electrical and environmental parameters.

Key Features

• Core Logic 3,072 logic elements (3072 logic cells) and a gate equivalent of 125,000 provide the device’s primary programmable logic capacity.
• On-chip Memory 36,864 bits of total RAM (≈0.037 Mbits) available for state storage, buffers and small data structures.
• I/O Density Up to 97 I/O pins for connecting sensors, peripherals and external logic interfaces.
• Power and Voltage Supported core supply voltage range from 1.425 V to 1.575 V for defined power-rail design and stability.
• Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13 × 13 mm) optimized for surface-mount PCB assembly in space-constrained layouts.
• Automotive Qualification and Temperature AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for use in temperature-stressed environments.
• Regulatory Compliance RoHS-compliant construction for conformance to lead-free assembly and environmental requirements.

Typical Applications

• Automotive Electronic Systems AEC-Q100 qualification and −40 °C to 125 °C operation make the device applicable to automotive ECU subsystems and related modules.
• Embedded Control and Interface The combination of 3,072 logic elements and 97 I/O supports embedded control, signal conditioning and interface glue logic in compact systems.
• Space-Constrained PCB Designs The 13 × 13 mm 144-FPBGA package suits applications where board space is limited but programmable logic is required.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification and a wide operating temperature range support use in automotive and other temperature-demanding environments.
• Balanced Logic and Memory: 3,072 logic elements paired with 36,864 bits of on-chip RAM provide a compact mix of programmable logic and embedded memory for control and interfacing tasks.
• Compact BGA Footprint: 144-FPBGA (13 × 13 mm) packaging reduces PCB area while retaining substantial I/O capability.
• Defined Supply Window: Narrow core supply range (1.425 V–1.575 V) supports predictable power design and rail management.
• Surface-Mount Ready: Surface-mount package type simplifies automated assembly for volume production.
• RoHS Compliant: Environmentally compliant manufacturing supports lead‑free assembly workflows.

Why Choose A3P125-1FG144T?

The A3P125-1FG144T offers a clear specification set for engineers who need a compact, qualified FPGA platform with a defined logic, memory and I/O balance. Its AEC-Q100 qualification and extended temperature range make it appropriate for automotive environments, while the 144-FPBGA package supports dense board layouts.

This device is suited to design teams requiring predictable electrical requirements (tight core voltage window), moderate on-chip memory, and several dozen I/O in a surface-mount, RoHS-compliant FPGA. It provides a straightforward, qualified option for embedded and automotive-focused programmable logic implementations.

Request a quote or contact sales to discuss availability, pricing and delivery for the A3P125-1FG144T.