A3P125-1FG144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 156 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-1FG144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 97 I/O, 36,864-bit RAM, 144-LBGA
The A3P125-1FG144I is a ProASIC3 Field Programmable Gate Array from Microchip Technology. It provides a medium-density reprogrammable logic solution with 3,072 logic elements and an array of on-chip resources for implementing custom digital functions.
Targeted at industrial applications, this device combines a 97-pin I/O complement, approximately 36,864 bits of embedded RAM, and a compact 144-LBGA package, offering integration and form-factor advantages for space-constrained, industrial designs.
Key Features
- Core and Logic 3,072 logic elements (LEs) and approximately 125,000 equivalent gates provide the programmable fabric for custom digital logic and glue-logic integration.
- Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) for buffering, FIFOs, and small data structures.
- I/O and System Integration 97 I/O pins support a broad range of peripheral interfacing and system-level signal routing in a single device.
- Power Core supply voltage specified at 1.425 V to 1.575 V to match system power-rail design requirements.
- Package and Mounting 144-LBGA package (supplier package 144-FPBGA 13×13) in a surface-mount form factor for compact PCB layouts.
- Operating Range and Grade Industrial-grade device with an operating temperature range of −40°C to 100°C suitable for industrial environments.
- Environmental Compliance RoHS compliant to meet common environmental and assembly requirements.
Typical Applications
- Industrial Control Implement control logic, signal conditioning, and interface glue logic using the device's logic elements and I/O resources in industrial equipment.
- Custom Digital Interfaces Build tailored protocol bridges and peripheral interfaces that require flexible I/O and on-chip memory for buffering.
- Embedded System Integration Integrate mid-density programmable logic into embedded designs where board space and deterministic I/O are important.
Unique Advantages
- Medium-density logic capacity: 3,072 logic elements and ~125k gates enable consolidation of multiple discrete functions into a single device, reducing BOM and board complexity.
- On-chip memory for data handling: 36,864 bits of embedded RAM supports small buffers and FIFOs without external memory, simplifying layout and lowering component count.
- Ample I/O count: 97 I/Os provide flexibility for a wide array of sensor, actuator, and peripheral connections in industrial systems.
- Industrial thermal range: −40°C to 100°C rating supports deployment in demanding temperature environments common to industrial applications.
- Compact LBGA package: 144-LBGA (13×13) surface-mount package enables high-density PCB designs while maintaining manufacturability.
- RoHS compliant: Conforms to environmental compliance expectations for modern electronic assemblies.
Why Choose A3P125-1FG144I?
The A3P125-1FG144I positions itself as a practical, industrial-grade FPGA for designs that need medium-density programmable logic, a substantial I/O complement, and on-chip RAM in a compact LBGA footprint. Backed by Microchip Technology, it is suited for engineers looking to consolidate discrete logic functions and implement custom digital interfaces within industrial product lines.
This device offers a balance of integration and environmental robustness for teams developing control, interface, and embedded systems where board space, deterministic I/O, and RoHS compliance are important considerations.
Request a quote or contact sales to discuss pricing, lead times, and availability for the A3P125-1FG144I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D