A3P125-1FGG144I

The A3P125-1FGG144I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offering mid-range programmable logic resources in a compact 144-LBGA package. With 3,072 logic elements (approximately 125,000 gates) and 36,864 bits of on-chip RAM, it targets industrial applications and embedded designs that require moderate logic density, substantial I/O, and stable operating conditions.

Key Features

• Core Logic — 3,072 logic elements providing approximately 125,000 usable gates for implementing combinational and sequential logic functions.
• Embedded Memory — 36,864 bits of on-chip RAM to support buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity — 97 configurable I/O pins to interface with sensors, peripherals, and external buses.
• Package & Mounting — 144-LBGA supplier device package (144-FPBGA, 13×13) designed for surface-mount assembly in compact boards.
• Power — Core supply range from 1.425 V to 1.575 V for integration with regulated power domains.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance — RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial Control — Implement motor control logic, sequencing, and I/O aggregation where industrial temperature tolerance and predictable logic density are required.
• Embedded Systems — Provide glue logic, protocol handling, and custom datapath functions in compact embedded platforms using on-chip RAM and moderate logic resources.
• Sensor and Signal Conditioning — Aggregate sensor inputs, perform preprocessing, and present conditioned signals to microcontrollers or systems with the available I/O and logic resources.
• Interface Bridging — Implement bus bridging, level adaptation, and custom peripheral interfaces using the 97 available I/O pins.

Unique Advantages

• Right-sized Logic Capacity: 3,072 logic elements and ~125,000 gates deliver predictable resources for mid-density designs without over-provisioning.
• On-chip Memory: 36,864 bits of embedded RAM reduce or eliminate the need for small external memories, simplifying BOM and board layout.
• High I/O Count: 97 I/O pins enable direct connectivity to multiple peripherals and sensors, lowering the need for external I/O expanders.
• Industrial Qualification: Rated for −40 °C to 100 °C and supplied in a robust 144-LBGA package suitable for industrial assemblies.
• Compact Surface-Mount Package: 144-FPBGA (13×13) package supports dense board integration while maintaining thermal and electrical performance expected in industrial designs.
• Regulatory Compliance: RoHS compliance aids in meeting lead-free assembly and regulatory requirements.

Why Choose A3P125-1FGG144I?

The A3P125-1FGG144I delivers a balanced mix of logic capacity, embedded memory, and I/O density in a compact industrial-grade package from Microchip Technology. It is well suited to engineers designing mid-density programmable logic solutions where stable operating temperature range, a defined power domain, and on-chip RAM reduce external components and simplify system architecture.

For projects that require a clearly scoped FPGA resource set—3,072 logic elements, 36,864 bits of RAM, and 97 I/Os—this ProASIC3 device provides a practical platform for industrial control, embedded processing, and interface logic implementations.

Request a quote or submit a sales inquiry to check pricing and availability for the A3P125-1FGG144I and to discuss how it fits your next design.