A3P1000L-FGG144

The A3P1000L-FGG144 is a ProASIC3L Field Programmable Gate Array (FPGA) IC designed for commercial electronic designs that require a balance of logic density, on-chip memory, and I/O capability. The device integrates 24,576 logic elements and approximately 0.147 Mbits (147,456 bits) of embedded memory to support medium-complexity digital functions.

With a supply voltage range of 1.14 V to 1.575 V, a 144-LBGA package, and a commercial operating temperature range of 0 °C to 85 °C, this FPGA suits surface-mount board designs where compact packaging and moderate environmental performance are required.

Key Features

• Core Logic 24,576 logic elements providing a total of 1,000,000 gates for implementing custom digital processing, control, and glue-logic functions.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, temporary storage, and state retention within user logic.
• I/O Capability 97 available I/Os to support a variety of external interfaces and board-level connectivity requirements.
• Power Operates from a voltage supply of 1.14 V to 1.575 V, enabling compatibility with low-voltage system domains.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
• Commercial Grade & Temperature Range Rated for commercial-grade operation from 0 °C to 85 °C to match typical consumer and industrial-adjacent applications.
• Regulatory RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial products.

Typical Applications

• Embedded Control Systems Implement custom control logic and state machines using available logic elements and on-chip RAM for local buffering.
• I/O Expansion and Glue Logic Leverage 97 I/Os to bridge peripherals, handle bus conversion, and consolidate discrete components into programmable logic.
• Signal Processing and Data Handling Use the FPGA’s logic array and embedded memory for intermediate processing, data alignment, and temporary storage tasks.
• Commercial Electronics Prototyping Support proof-of-concept and production designs where a commercial-grade FPGA with moderate logic density is required.

Unique Advantages

• Balanced Logic Density: 24,576 logic elements and 1,000,000 gates provide sufficient capacity for medium-complexity designs without unnecessary overhead.
• On-chip Memory: Approximately 147,456 bits of embedded RAM reduce the need for external memory in many buffering and state-retention use cases.
• Flexible I/O Count: Ninety-seven I/Os accommodate multiple interfaces and peripheral connections, simplifying board-level integration.
• Compact Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) footprint enables dense PCB layouts and integration into space-constrained designs.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product and assembly requirements.
• Manufacturer Backing: Produced by Microchip Technology, providing product continuity and access to manufacturer documentation.

Why Choose A3P1000L-FGG144?

The A3P1000L-FGG144 positions itself as a practical FPGA choice for designers who need a mid-range programmable logic device with a clear balance of logic elements, embedded memory, and a substantial I/O count in a compact surface-mount package. Its power and temperature specifications make it suitable for a wide range of commercial electronic designs where on-chip resources and board-level integration are priorities.

This device is well suited to engineering teams developing embedded controllers, interface bridges, and signal-processing blocks that benefit from programmable logic. Backed by Microchip Technology and accompanied by manufacturer documentation, the part offers a straightforward path for designs that require scalability and predictable supply-chain integration.

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