A3P1000L-FG144

The A3P1000L-FG144 is a ProASIC3L field programmable gate array (FPGA) IC designed for commercial-grade electronic designs. It provides reprogrammable logic in a compact 144-LBGA package with a defined set of logic resources and I/O for embedded and system-level applications.

With 24,576 logic elements, 97 user I/O pins and 147,456 bits of on-chip RAM, this device targets applications that require deterministic, reconfigurable logic in a surface-mount, RoHS-compliant package.

Key Features

• Logic Capacity 24,576 logic elements (LAB/CLB-equivalent) and a gate capacity of 1,000,000 provide a defined resource set for implementing custom logic and control functions.
• On-Chip Memory 147,456 bits of embedded RAM for buffering, state storage and small lookup tables within the FPGA fabric.
• Programmable I/O 97 user I/O pins to interface with peripherals, sensors and system buses in compact designs.
• Voltage Supply Operates from 1.14 V to 1.575 V, enabling integration with low-voltage system rails.
• Package and Mounting 144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount form factor suited to high-density PCB layouts.
• Temperature and Grade Commercial grade device with an operating temperature range of 0°C to 85°C for standard commercial environments.
• Environmental Compliance RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Commercial Embedded Systems Use the programmable fabric to implement control logic, interfaces and custom peripherals in compact commercial devices.
• Communications and Networking Equipment Implement protocol glue logic and interface bridging using the device’s I/O and reprogrammable logic resources.
• Prototyping and Evaluation Suitable for developers requiring reconfigurable logic capacity in a BGA package for board-level validation and functional prototyping.

Unique Advantages

• Defined Logic Density: 24,576 logic elements and 1,000,000 gates provide a clear capacity for mapping mid-scale logic functions without over-specifying resources.
• On-Die Memory Availability: 147,456 bits of embedded RAM reduce the need for external memory for small buffering and state machines.
• Compact BGA Package: 144-LBGA / 144-FPBGA (13×13) enables high-density PCB integration while keeping the module footprint small.
• Commercial Temperature Range: Rated for 0°C to 85°C, suitable for a wide range of non-industrial, commercial deployments.
• Controlled Supply Range: Explicit 1.14 V to 1.575 V supply window aids power-rail planning in low-voltage systems.
• RoHS Compliant: Aligns with common environmental and manufacturing requirements for commercial products.

Why Choose A3P1000L-FG144?

The A3P1000L-FG144 balances a clearly defined logic and memory footprint with a compact 144-LBGA package for commercial electronic designs that require reprogrammable logic. Its 24,576 logic elements, 97 I/O pins and on-chip RAM provide the resources to implement control, interface and mid-scale logic functions while keeping BOM and board area considerations in view.

This device is well suited to designers and OEMs building commercial equipment that benefit from field-programmable logic, predictable resource sizing and surface-mount BGA integration in standard temperature environments.

Request a quote or submit an inquiry to learn more about availability and pricing for the A3P1000L-FG144. Our team can provide ordering details and support for procurement needs.