A3P1000L-1FGG144

The A3P1000L-1FGG144 is a ProASIC3L Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a combination of logic density, embedded RAM, and a compact BGA package suitable for commercial embedded designs.

With 24,576 logic elements, 147,456 total RAM bits, and 97 I/O pins, this surface-mount FPGA targets applications that require mid-range programmable logic capacity in a 144-ball BGA footprint. The device operates from a 1.14 V to 1.575 V supply and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic Density — 24,576 logic elements (reported as CLBs/logic elements) providing up to 1,000,000 gates for implementing mid-range digital functions and custom logic.
• Embedded Memory — 147,456 total RAM bits of on-chip memory (approximately 0.14 Mbits) to support buffering, state machines, and local data storage.
• I/O Capacity — 97 user I/O pins available to interface with peripherals, sensors, and external buses in compact systems.
• Power — Low-voltage operation with a supply range of 1.14 V to 1.575 V to match modern low-voltage system rails.
• Package and Mounting — Supplied in a 144-LBGA package; supplier device package listed as 144-FPBGA (13×13). Surface-mount mounting simplifies PCB assembly in space-constrained designs.
• Commercial Grade & Compliance — Commercial temperature rating (0 °C to 85 °C) and RoHS compliant for regulatory conformity in consumer and commercial products.

Typical Applications

• Embedded System Logic — Implement custom glue logic, protocol bridging, and control functions where moderate logic density and on-chip RAM are required.
• Consumer Electronics — Integrate peripheral control and custom interfaces within compact, surface-mount product form factors.
• Prototyping and Evaluation — Use as a programmable platform for validating digital designs and proof-of-concept implementations.
• Custom Peripherals — Build application-specific peripherals or preprocess data streams using available logic elements and embedded memory.

Unique Advantages

• High Logic Capacity: 24,576 logic elements and 1,000,000 gates enable complex logic implementations without resorting to multiple devices.
• On-Chip Memory: 147,456 RAM bits provide embedded storage for buffering and state data, reducing external memory requirements.
• Compact BGA Footprint: 144-ball LBGA/FPBGA (13×13) package offers a small PCB footprint while supporting a substantial I/O count.
• Low-Voltage Operation: 1.14 V to 1.575 V supply compatibility aligns with modern low-voltage system designs.
• Surface-Mount Ready: Designed for surface-mount assembly to streamline manufacturing and reduce board-level complexity.
• RoHS Compliant: Meets RoHS requirements to support regulatory needs for consumer and commercial products.

Why Choose A3P1000L-1FGG144?

The A3P1000L-1FGG144 balances mid-range logic density, embedded memory, and a compact BGA package for commercial embedded applications. Its combination of 24,576 logic elements, 147,456 RAM bits, and 97 I/O make it suitable for designers who need programmable logic capacity in space-constrained, surface-mount boards.

Choose this ProASIC3L FPGA when your design requires programmable integration, moderate on-chip memory, and low-voltage operation within a commercial temperature range, while also benefiting from RoHS compliance and a compact 144-ball BGA package.

Request a quote or submit a purchase inquiry to evaluate the A3P1000L-1FGG144 for your next design project.