A3P1000L-1FG256

The A3P1000L-1FG256 is a ProASIC3L family FPGA from Microchip Technology providing a programmable logic solution with 24,576 logic elements and approximately 0.147 Mbits of embedded RAM. It combines a 1,000,000-gate fabric with 177 user I/Os in a compact 256-LBGA package for commercial electronic designs.

Designed for commercial-grade embedded and consumer applications, the device supports surface-mount assembly and operates from a 1.14 V to 1.575 V supply within a 0 °C to 85 °C temperature range. It is RoHS compliant and offered in a 256-FPBGA (17×17) supplier package.

Key Features

• Core Logic 24,576 logic elements (cells) providing a programmable fabric capable of implementing complex digital functions.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) to support buffering, state storage, and small data structures.
• I/O Capability 177 user I/Os to support dense external connectivity and interface requirements.
• Gate Capacity 1,000,000 gates of logic capacity for medium-complexity system integration.
• Power Operates from a core supply range of 1.14 V to 1.575 V to match modern low-voltage system architectures.
• Package & Mounting 256-LBGA package, supplier device package 256-FPBGA (17×17), designed for surface-mount assembly.
• Temperature & Grade Commercial grade operation across 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for reduced restricted substance concerns in commercial manufacturing.

Typical Applications

• Custom Digital Logic — Implement user-defined processing, control state machines, and custom datapaths using the device's 24,576 logic elements.
• Interface Bridging & I/O Expansion — Use the 177 I/Os to concentrate or bridge multiple peripheral interfaces and expand connectivity in compact systems.
• Prototyping & Development — Leverage the programmable fabric and embedded RAM to validate digital architectures and iterate designs without ASIC spin cycles.
• Embedded Control — Integrate control logic and buffering in commercial embedded products while meeting surface-mount assembly requirements.

Unique Advantages

• High logic density: 24,576 logic elements and 1,000,000 gates provide substantial capacity for medium-complexity designs without moving to larger packages.
• Integrated memory: Approximately 0.147 Mbits of on-chip RAM reduces external memory dependency for small buffers and state storage.
• Generous I/O count: 177 user I/Os enable broad external interfacing and flexible pin allocation for system designs.
• Compact BGA packaging: 256-LBGA / 256-FPBGA (17×17) offers a space-efficient footprint suitable for dense board layouts and surface-mount production.
• Low-voltage operation: Core supply range of 1.14 V to 1.575 V aligns with modern low-voltage digital systems.
• Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial manufacturing environments.

Why Choose A3P1000L-1FG256?

The A3P1000L-1FG256 from Microchip Technology delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a compact 256-LBGA package. Its 24,576 logic elements, approximately 0.147 Mbits of RAM, and 177 I/Os make it well suited to commercial embedded designs that require flexible, reconfigurable logic and moderate on-chip resources.

This device is suited to teams and designs that need a programmable solution for interface consolidation, custom control logic, and prototype validation while adhering to commercial temperature and RoHS requirements. Its surface-mount 256-FPBGA (17×17) packaging supports compact board layouts and standard assembly flows.

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