A3P1000L-1FGG256

The A3P1000L-1FGG256 is a ProASIC3L field programmable gate array (FPGA) device provided in a 256‑LBGA package. It delivers a medium-density programmable logic fabric with 24,576 logic elements and approximately 0.147 Mbits of embedded memory, suitable for commercial embedded designs that require flexible on-chip logic and I/O integration.

Designed for surface‑mount assembly and commercial temperature operation, the device combines a sizeable gate count and dedicated RAM with 177 user I/O pins, enabling system designers to implement custom logic, glue functions, and mid‑range integration in compact packages.

Key Features

• Core Density 24,576 logic elements supporting up to 1,000,000 gates for mid‑range programmable logic implementations.
• Embedded Memory Approximately 0.147 Mbits of on‑chip RAM (147,456 bits) for local storage, buffering, and state machine implementation.
• I/O and Package 177 available I/O pins in a 256‑LBGA package; supplier device package listed as 256‑FPBGA (17×17). The surface‑mount package supports compact board layouts.
• Power Supply Range Operates from 1.14 V to 1.575 V, allowing compatibility with a range of system power rails within the specified operating window.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronics applications.
• Regulatory Compliance RoHS compliant for lead‑free assembly and adherence to common environmental requirements.

Typical Applications

• Commercial embedded systems — Integration of custom logic and interfacing functions where medium logic density and on‑chip RAM are required.
• Digital glue and protocol bridging — Implement protocol translators, bus glue logic, and timing adaptation using the device’s logic resources and I/O count.
• Prototyping and evaluation — Use as a configurable platform for evaluating system partitioning and custom logic before production.

Unique Advantages

• Balanced logic and memory capacity: 24,576 logic elements and 147,456 bits of RAM provide a combination of resources appropriate for medium‑complexity designs.
• Generous I/O in a compact package: 177 I/Os in a 256‑LBGA (256‑FPBGA, 17×17) package simplify board design while maintaining signal density.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
• Wide core voltage range: 1.14 V to 1.575 V supply range enables flexibility with common system power rails.
• RoHS compliant: Supports lead‑free manufacturing processes and environmental compliance needs.

Why Choose A3P1000L-1FGG256?

The A3P1000L-1FGG256 positions itself as a practical choice for commercial embedded designs that need a mid‑range FPGA with a balanced mix of logic elements, embedded RAM, and a substantial number of I/Os in a compact BGA package. Its specifications—1,000,000 gates, 24,576 logic elements, and 177 I/Os—make it suitable for custom logic integration, protocol bridging, and system prototyping within standard commercial temperature ranges.

For teams seeking scalable, reprogrammable logic with RoHS compliance and surface‑mount assembly compatibility, this ProASIC3L device provides a reliable platform backed by established vendor documentation and resources.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the A3P1000L-1FGG256. Our team can assist with lead times and volume pricing to support your design and procurement needs.