A3P1000L-1FG256I

The A3P1000L-1FG256I is a ProASIC3L FPGA from Microchip Technology designed for industrial applications. It provides a dense logic fabric with 24,576 logic elements, integrated on-chip RAM, and a broad I/O count to support complex embedded and control designs.

This surface-mount FPGA combines substantial gate capacity and memory with a compact 256-LBGA package and industrial operating range, making it suited for applications that require reliable, flexible logic implementation within constrained footprints.

Key Features

• Logic Capacity 24,576 logic elements (equivalent to the device's specified CLB count) and approximately 1,000,000 gates to implement complex digital functions and custom logic.
• Embedded Memory 147,456 total RAM bits on-chip (approximately 0.147 Mbits) to store buffers, state machines, and lookup tables without external memory.
• I/O and Interfacing 177 user I/Os to support multiple peripheral connections, sensor interfaces, and board-level signaling requirements.
• Power Operates from a supply range of 1.14 V to 1.575 V, enabling designs that target low-voltage systems.
• Package and Mounting Available in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB integration.
• Temperature and Grade Industrial grade with an operating temperature range of −40°C to 100°C for demanding environments.
• Regulatory RoHS compliant for use in designs where lead-free, environmentally conscious components are required.

Typical Applications

• Industrial Control — Implement motor control, PLC I/O expansion, and real-time logic using the device's logic density and broad I/O complement.
• Embedded Systems — Use as a configurable logic backbone for custom signal processing, glue logic, or protocol adaptation in embedded platforms.
• Instrumentation & Test Equipment — Integrate custom timing, data aggregation, and interface logic while keeping board area compact with the 256-LBGA package.
• Communications Nodes — Implement protocol handling, parallel front-end logic, and I/O concentration with on-chip memory resources supporting buffering and state management.

Unique Advantages

• High Integration Density: 24,576 logic elements and roughly 1,000,000 gates provide substantial capacity for consolidating discrete logic into a single device.
• On-chip RAM: 147,456 RAM bits (≈0.147 Mbits) reduce or eliminate the need for external memory in many buffering and LUT applications.
• Extensive I/O Count: 177 I/Os enable flexible interfacing to sensors, peripherals, and other board-level devices without extra glue logic.
• Industrial Temperature Range: Specified operation from −40°C to 100°C supports deployment in a wide range of industrial environments.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) saves PCB area while delivering the connectivity and thermal characteristics expected in dense designs.
• Low-Voltage Operation: 1.14 V to 1.575 V supply range enables integration into low-voltage power architectures.

Why Choose A3P1000L-1FG256I?

The A3P1000L-1FG256I positions itself as a robust industrial-grade FPGA option, combining substantial logic and memory resources with a high I/O count and compact LBGA footprint. Its specification set supports engineers who need to consolidate discrete functions, implement custom interfaces, or add deterministic logic to embedded systems.

Backed by Microchip Technology, this ProASIC3L device is suitable for teams designing industrial and instrumentation products that require a balance of integration, temperature resilience, and low-voltage operation, delivering scalable capacity for present designs and future feature growth.

Request a quote or submit an inquiry to purchase the A3P1000L-1FG256I and start integrating a compact, industrial-grade FPGA into your next design.