A3P1000L-1FGG256I

The A3P1000L-1FGG256I is a ProASIC3L field programmable gate array from Microchip Technology configured in a 256-LBGA package. It combines substantial logic density, on-chip memory, and a high I/O count to address embedded digital logic, interface bridging, and control tasks in industrial applications.

Designed for surface-mount integration, this device targets applications that require a compact, programmable hardware resource with a defined operating voltage range and industrial temperature capability.

Key Features

• Logic Density  Provides 24,576 logic elements (approximately 1,000,000 gates) to implement medium-complexity digital functions and custom logic blocks.
• Embedded Memory  Includes approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, FIFOs, and small data storage.
• I/O Capability  Offers 177 I/O pins to support multiple external interfaces, parallel buses, and mixed-signal front ends.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.575 V, enabling low-voltage system designs.
• Package & Mounting  Delivered in a 256-LBGA package (supplier package: 256-FPBGA, 17 × 17) for high pin-density surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for extended-temperature industrial deployments.
• Regulatory  RoHS compliant, supporting lead-free assembly and regulatory requirements for many commercial and industrial products.

Typical Applications

• Industrial Automation: Implement custom logic for PLC extensions, I/O aggregation, and control algorithms where the industrial temperature range and high I/O count are required.
• Communications & Interfaces: Bridge protocols, handle parallel-to-serial conversions, or implement custom interface logic leveraging the device’s I/O density and embedded memory for buffering.
• Test & Measurement: Realize signal preprocessing, trigger logic, and data formatting in compact fixtures or instrumentation modules using the on-chip RAM and logic elements.
• Embedded System Integration: Offload deterministic control tasks and glue logic from microcontrollers in compact, surface-mount designs thanks to the 256-LBGA footprint and programmable resources.

Unique Advantages

• High Logic Capacity: 24,576 logic elements and roughly 1,000,000 gates permit complex state machines and data-path implementations without external CPLDs.
• Compact, High-Pin Package: 256-LBGA (17 × 17) provides a high I/O count in a space-efficient surface-mount form factor to save board area.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM supports buffering and temporary data storage directly within the FPGA fabric, reducing external memory requirements.
• Low-Voltage Operation: Core supply range of 1.14 V to 1.575 V allows integration into modern low-voltage power domains.
• Industrial Reliability: Rated operation from −40 °C to 100 °C and an industrial grade designation align the device with long-life, temperature-demanding deployments.
• RoHS Compliant: Ensures compatibility with lead-free manufacturing processes and environmental regulations.

Why Choose A3P1000L-1FGG256I?

The A3P1000L-1FGG256I positions itself as a versatile ProASIC3L FPGA for engineers who need a balance of logic capacity, embedded memory, and a high I/O count in a compact surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for deployments where environmental resilience and regulatory alignment matter.

This device is well suited to designers building industrial control systems, communications interfaces, test equipment, and embedded platforms that require programmable hardware resources with defined electrical and thermal characteristics backed by Microchip Technology.

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