A3P1000L-FG256

The A3P1000L-FG256 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded applications. It provides a high logic density device with 24576 logic elements, on-chip embedded memory, and up to 177 user I/Os in a compact 256-LBGA package.

This device targets commercial designs that require programmable logic, configurable I/O counts and predictable operating conditions defined by its supply voltage range and commercial temperature rating.

Key Features

• Core Logic  Approximately 24,576 logic elements delivering up to 1,000,000 gates of programmable logic for glue-logic, custom processing and control functions.
• Embedded Memory  Total on-chip RAM of 147,456 bits, providing approximately 0.147 Mbits of embedded memory for buffering, state storage and small data structures.
• I/O Capability  Up to 177 user I/Os to support diverse interface requirements and connectivity within a single device footprint.
• Power Range  Operates from 1.14 V to 1.575 V supply, enabling designs that need defined low-voltage core operation.
• Package and Mounting  Available in a 256-LBGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for compact board integration.
• Operating Temperature  Commercial-grade temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Compliance  RoHS compliant, meeting standard environmental restrictions for electronic components.

Typical Applications

• Commercial Embedded Systems  Programmable logic for control, signal processing or custom peripheral integration within commercial products operating at 0 °C to 85 °C.
• Interface and Glue Logic  Use the device’s 177 I/Os to consolidate multiple interface functions and reduce board-level component count.
• Prototyping and Custom IP  A flexible platform for developing and validating custom logic architectures and small-scale IP cores.
• Communications and Connectivity  Implement protocol adaptation, buffering and data path logic leveraging on-chip memory and programmable logic resources.

Unique Advantages

• High Logic Density:  24,576 logic elements and 1,000,000 gates enable substantial programmable functionality in a single device.
• Compact Package:  256-LBGA (256-FPBGA, 17×17) minimizes PCB area while providing a large I/O count for complex designs.
• Ample I/O:  177 I/Os allow integration of multiple interfaces and peripherals without external I/O expanders.
• Defined Voltage Window:  Operation across 1.14 V to 1.575 V supports designs requiring a specific low-voltage core domain.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C to match common commercial deployment environments.
• RoHS Compliant:  Meets environmental restrictions for lead-free assembly and regulatory requirements for many commercial products.

Why Choose A3P1000L-FG256?

The A3P1000L-FG256 positions itself as a versatile, commercially graded FPGA option for designers who need substantial programmable logic, a high I/O count and on-chip memory in a compact LBGA package. Its defined supply voltage range and commercial temperature rating make it suitable for a broad range of standard commercial embedded applications.

Backed by Microchip Technology, this device is suited for teams developing custom logic, prototyping new architectures, or consolidating multiple interface functions into a single programmable device to simplify BOM and board layout.

Request a quote or contact sales to discuss pricing and availability for the A3P1000L-FG256 and to obtain additional ordering information.