A3P1000L-FG256I

The A3P1000L-FG256I is a ProASIC3L family FPGA in a 256‑LBGA package designed for industrial-grade embedded logic integration. It delivers a balance of on‑chip logic density, I/O count and embedded memory suitable for control, interfacing and mid-density programmable logic tasks in industrial environments.

Key value is provided through its 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, up to 177 I/O pins and a wide operating temperature range, enabling robust deployment where temperature and compliance requirements matter.

Key Features

• Core Logic  24,576 logic elements (logic cells) and approximately 1,000,000 gates provide mid-density programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 0.147 Mbits of on‑chip RAM (147,456 total RAM bits) to support buffering, small FIFOs and local data storage within user logic.
• I/O Resources  Up to 177 I/O pins enable extensive external interfacing for sensors, buses and peripheral devices.
• Power Supply Range  Operates from 1.14 V to 1.575 V supply rails, supporting low‑voltage core environments.
• Package & Mounting  256‑LBGA package (supplier device package: 256‑FPBGA, 17×17) with surface mount construction for compact board integration.
• Temperature & Grade  Industrial grade device rated for -40 °C to 100 °C operation, suitable for demanding ambient conditions.
• Compliance  RoHS compliant to meet environmental and regulatory requirements for lead‑free assembly.

Typical Applications

• Industrial Automation  Implement custom control logic, signal conditioning and interface glue for PLCs and factory automation equipment using the device's logic density and extended temperature rating.
• Communications Equipment  Use the FPGA for protocol bridging, packet processing or custom I/O handling where 177 accessible I/O and embedded RAM aid buffering and handshaking.
• Instrumentation & Test  Deploy as configurable front‑end logic for measurement and test instruments that require flexible data handling and robust operation over a wide temperature range.
• Embedded Systems  Integrate custom peripheral controllers, timing logic and interface adaptation in compact, surface‑mount designs.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements enable complex custom functions without external ASICs, simplifying board-level design.
• On‑Chip Memory for Local Data Handling: Approximately 0.147 Mbits of embedded RAM supports buffering and small data structures directly in the fabric.
• High I/O Count: 177 I/O pins provide flexible external connectivity for sensors, buses and peripherals, reducing the need for additional I/O expanders.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for deployments in temperature‑varying industrial environments.
• Compact Surface‑Mount Package: 256‑LBGA (256‑FPBGA 17×17) enables high density board layouts while maintaining robust soldered connections.
• RoHS Compliance: Meets lead‑free assembly requirements for environmentally conscious manufacturing.

Why Choose A3P1000L-FG256I?

The A3P1000L-FG256I positions itself as an industrial‑grade mid-density FPGA suited for engineers who need a compact, surface‑mount programmable device with significant logic resources, embedded memory and a high I/O count. Its operating range from -40 °C to 100 °C and RoHS compliance make it appropriate for industrial and embedded applications requiring reliable operation and regulatory alignment.

This device is an option for designs that require on‑board programmability, local memory for buffering, and a substantial number of I/Os in a 256‑ball BGA footprint, offering a scalable building block for custom digital logic integration.

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