A3P1000-PQG208M

The A3P1000-PQG208M is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a hardware-configurable logic fabric with 24,576 logic elements and approximately 0.147 Mbits of embedded memory for mid-density programmable logic designs.

With military grading and qualification to MIL-STD-883, a wide operating temperature range and a tight core supply voltage window, this device is targeted at applications that require ruggedized, reliable programmable logic in a compact surface-mount package.

Key Features

• Core Capacity — Approximately 1,000,000 gates implemented across 24,576 logic elements, enabling complex combinational and sequential logic implementations.
• Embedded Memory — 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, lookup tables, and state storage.
• I/O Count — 154 user I/Os to support multiple peripherals, bus interfaces, and parallel connections.
• Power Supply — Specified core supply voltage range of 1.425 V to 1.575 V for predictable power and timing behavior.
• Package & Mounting — 208-BFQFP package in a surface-mount form factor; supplier package listed as 208-PQFP (28x28).
• Temperature & Qualification — Operating temperature range from -55 °C to 125 °C and qualified to MIL-STD-883, suitable for military-grade and ruggedized system requirements.
• Compliance — RoHS compliant, supporting regulatory and supply-chain environmental requirements.

Typical Applications

• Military and Ruggedized Electronics — MIL-STD-883 qualification and a wide temperature range make the device suitable for defense and other rugged applications requiring qualified components.
• Embedded Control Systems — High logic capacity and 154 I/Os enable integration of control, glue-logic, and interface functions in compact embedded designs.
• Signal Processing and I/O Aggregation — On-chip RAM and abundant I/O make the FPGA useful for buffering, protocol bridging, and parallel data handling tasks.

Unique Advantages

• Military Qualification: MIL-STD-883 qualification and a −55 °C to 125 °C operating range deliver traceable pedigree for defense and high-reliability programs.
• Balanced Logic and Memory: 24,576 logic elements combined with 147,456 bits of embedded RAM allow mixed compute and buffering tasks on a single device, reducing external component count.
• High I/O Density: 154 user I/Os provide flexible interfacing options for multi-peripheral systems and parallel data paths.
• Compact Surface-Mount Package: 208-BFQFP (supplier: 208-PQFP (28x28)) enables dense PCB integration while maintaining a large I/O count.
• Controlled Power Envelope: Narrow supply range (1.425 V–1.575 V) supports predictable power budgeting and timing characteristics across production units.
• Regulatory Compliance: RoHS compliance simplifies environmental qualification and procurement for regulated programs.

Why Choose A3P1000-PQG208M?

The A3P1000-PQG208M positions itself as a rugged, mid-density FPGA solution that combines substantial logic capacity, embedded memory, and plentiful I/O in a military-qualified package. Its electrical and thermal specifications are tailored for designs that require predictable operation across wide temperature ranges and formal qualification to MIL-STD-883.

Engineers and procurement teams looking for a Microchip Technology FPGA with defined military-grade credentials, compact surface-mount packaging, and a balance of logic, memory and I/O integration will find this device suitable for long-term deployment in demanding embedded and defense systems.

Request a quote or submit a procurement inquiry for A3P1000-PQG208M to receive pricing and availability information tailored to your program requirements.