A3P1000-PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 154 147456 208-BFQFP |
|---|---|
| Quantity | 900 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 154 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of A3P1000-PQ208I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 154 I/O, 147,456-bit RAM, 208-BFQFP
The A3P1000-PQ208I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for industrial applications. It provides a balance of logic capacity, on-chip memory, and I/O count in a 208-pin BFQFP surface-mount package.
With 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 154 I/Os, this device is suited for designs that require programmable logic, moderate embedded memory, and extensive I/O connectivity within a defined industrial temperature range.
Key Features
- Logic Capacity — 24,576 logic elements to implement custom digital logic and control functions.
- Embedded Memory — Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, lookup tables, and state storage.
- I/O Resources — 154 user I/Os to support a variety of parallel and serial interfacing needs within a single device.
- Gate Count — 1,000,000 gates providing equivalent silicon resource context for system-level integration.
- Power — Core supply voltage range from 1.425 V to 1.575 V for controlled power delivery and design planning.
- Package & Mounting — 208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement custom control logic and I/O interfacing for factory automation and process control leveraging the device's 24,576 logic elements and 154 I/Os.
- Protocol Bridging and Interfaces — Realize interface logic and data buffering using on-chip RAM and abundant I/O to connect diverse subsystems.
- Embedded System Integration — Consolidate glue logic and peripheral handling into a single FPGA package to reduce component count and PCB complexity.
Unique Advantages
- High Logic Density: 24,576 logic elements enable substantial custom digital implementation within one device.
- Embedded Memory Availability: Approximately 0.147 Mbits of RAM provides local storage for buffering, state machines, and lookup tables without external memory.
- Generous I/O Count: 154 I/Os allow extensive peripheral and bus interfacing without additional I/O expanders.
- Industrial-Grade Operation: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
- Compact Surface-Mount Package: 208-BFQFP (28×28 supplier PQFP footprint) delivers high pin count in a standard SMT form factor for streamlined PCB layout.
- Defined Core Voltage Range: 1.425 V to 1.575 V core supply simplifies power-supply design and validation.
Why Choose A3P1000-PQ208I?
The A3P1000-PQ208I positions itself as a robust, industrial-grade FPGA option with a solid mix of logic elements, embedded memory, and I/O capacity in a 208-pin surface-mount package. It is well suited to engineering teams seeking to consolidate logic, implement custom interfaces, and maintain operation across wide industrial temperature conditions.
Backed by Microchip Technology, the device delivers measurable on-chip resources and clear electrical and thermal specifications to support reliable deployment and lifecycle planning for industrial designs.
Request a quote or submit a pricing inquiry to get availability and lead-time information for the A3P1000-PQ208I.

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