A3P1000-FGG484T

The A3P1000-FGG484T is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It integrates 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM and up to 300 general-purpose I/O in a 484-BGA surface-mount package.

Designed and qualified for automotive environments (AEC-Q100), this device combines integration density, a defined supply voltage window and a wide operating temperature range to support applications that require reliable, compact programmable logic in demanding conditions.

Key Features

• Logic Capacity  24,576 logic elements (reported as logic element cells) and 1,000,000 gates provide resources for medium-complexity logic implementation and custom digital functions.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, state storage and control logic.
• I/O Count  Up to 300 I/O pins support multiple parallel interfaces and system interconnect requirements from a single device.
• Package and Mounting  484-BGA package (supplier device package: 484-FPBGA, 23 × 23) in a surface-mount form factor for compact board-level integration.
• Power Supply  Specified operating supply voltage range of 1.425 V to 1.575 V to match system power rails and enable predictable device behavior.
• Automotive Qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for deployment in in-vehicle environments.

Typical Applications

• Automotive Control Modules  Use in vehicle control or gateway modules where AEC-Q100 qualification, wide temperature range and flexible I/O counts are required.
• Sensor Interface and Signal Conditioning  Implement custom sensor aggregation, protocol bridging and preprocessing using the device’s logic capacity and embedded RAM.
• In-vehicle Communication and I/O Expansion  Provide additional digital interfaces and I/O expansion for electronic control units requiring compact, surface-mount programmable logic.

Unique Advantages

• High integration density: 24,576 logic elements and 1,000,000 gates allow substantial functional consolidation onto a single device, reducing external components.
• Sufficient embedded memory: Approximately 0.147 Mbits of on-chip RAM supports buffering and state retention without immediate need for external memory.
• Automotive-grade reliability: AEC-Q100 qualification and an operating range of −40°C to 125°C align the device to in-vehicle environmental requirements.
• Compact BGA package: 484-BGA (484-FPBGA, 23 × 23) surface-mount package enables dense PCB layouts and controlled form factor integration.
• Defined supply window: Tight voltage supply spec (1.425 V to 1.575 V) supports deterministic power design and predictable device operation.
• Generous I/O: 300 available I/O pins offer flexibility for multi-channel interfaces and mixed-signal system connectivity.

Why Choose A3P1000-FGG484T?

The A3P1000-FGG484T positions itself as a robust, automotive-qualified FPGA option for designers who need mid-range logic capacity, on-chip memory and a significant I/O complement in a compact BGA package. Its AEC-Q100 qualification and −40°C to 125°C operating range make it suitable for applications that demand consistent operation across automotive temperature extremes.

This device is well suited to teams developing in-vehicle controllers, sensor interfaces and I/O-expansion designs that benefit from on-board programmability, component consolidation and a clearly specified supply and thermal window. Backed by Microchip Technology, it provides a scalable programmable logic building block for production automotive designs.

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