A3P1000-FGG484

The A3P1000-FGG484 is a ProASIC3 FPGA from Microchip Technology packaged in a 484-ball BGA (484-FPBGA, 23×23) surface-mount package. It provides 24,576 logic elements and approximately 1,000,000 gates with 300 user I/O pins, making it suitable for designs that require substantial programmable logic and flexible I/O routing.

On-chip resources include 147,456 bits of embedded RAM (approximately 0.147 Mbits). The device operates from a core supply range of 1.425 V to 1.575 V and is qualified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Logic Capacity 24,576 logic elements (programmable logic cells) providing approximately 1,000,000 gates for implementing custom digital functions.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for local data buffering and state storage.
• I/O Density 300 user I/O pins to support multiple external interfaces and parallel connections.
• Package and Mounting 484-ball BGA (484-FPBGA, 23×23) surface-mount package for compact board integration and high pin-count routing.
• Power Supply Core voltage supply range 1.425 V to 1.575 V to match supported system power domains.
• Operating Range Commercial temperature grade rated for 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Digital Logic Implement application-specific state machines, protocol handlers, and data-path logic using the device's 24,576 logic elements.
• I/O-Intensive Interfaces Support multiple external peripherals and parallel connections with 300 user I/Os.
• On-Chip Data Buffering Use the embedded RAM (147,456 bits) for small data buffers, FIFOs, or temporary storage within system logic.
• Compact Board Designs Leverage the 484-BGA (23×23) package for high pin count in a compact surface-mount footprint.

Unique Advantages

• High Logic Integration: 24,576 logic elements and roughly 1,000,000 gates allow the consolidation of multiple functions into a single device, reducing BOM count.
• Substantial I/O Resources: 300 I/Os provide flexibility for interfacing to a wide range of external devices and parallel buses.
• On-Chip Memory: 147,456 bits of embedded RAM enable local buffering and reduce external memory requirements for modest data storage needs.
• Compact, High-Pin Package: The 484-FPBGA (23×23) package delivers a high pin count in a small area suitable for dense PCB layouts.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, matching typical commercial system requirements.
• RoHS Compliant: Conforms to RoHS environmental requirements for lead-free assembly.

Why Choose A3P1000-FGG484?

The A3P1000-FGG484 positions itself as a versatile ProASIC3 FPGA option for designs that require significant programmable logic capacity, ample I/O, and on-chip memory within a compact BGA package. Its combination of 24,576 logic elements, 300 I/Os, and embedded RAM supports consolidated implementation of custom digital functions and interface logic.

This device is well suited for engineers and teams seeking a commercial-grade FPGA solution that balances logic density, I/O count, and package integration while meeting RoHS requirements and standard commercial temperature operation.

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