A3P1000-FGG256I

The A3P1000-FGG256I is a ProASIC3 family FPGA IC offering 24,576 logic elements and approximately 0.147 Mbits of embedded memory. Packaged in a 256-LBGA (256-FPBGA 17×17) surface-mount package and rated for industrial operation, it provides a compact, low-voltage programmable-logic solution for designs that require significant logic capacity and I/O density.

With 177 I/O pins, a gate count of 1,000,000, and a supply range of 1.425 V to 1.575 V, this device targets applications that need on-chip logic, memory, and flexible interfacing within an industrial temperature range.

Key Features

• Core Logic 24,576 logic elements delivering 1,000,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for local data storage and buffering.
• I/O Density 177 user I/O pins to support multiple parallel interfaces and system interconnect requirements.
• Power Operates from a dedicated core supply range of 1.425 V to 1.575 V for predictable, tightly specified core power behavior.
• Package & Mounting 256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount format for high-density board integration.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex logic functions using 24,576 logic elements and abundant gate capacity.
• Control and interface systems — 177 I/O pins provide the connectivity needed for control signals, parallel interfaces, and external peripherals.
• Embedded memory buffering — Approximately 0.147 Mbits of on-chip RAM supports local data buffering and small lookup tables.

Unique Advantages

• Substantial programmable capacity: 24,576 logic elements and 1,000,000 gates enable implementation of sizeable custom logic blocks on a single device.
• High I/O count: 177 I/O pins reduce the need for external multiplexing and simplify board-level interfacing.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging installations.
• Compact BGA footprint: 256-LBGA (256-FPBGA 17×17) package supports space-constrained designs while maintaining signal density.
• RoHS compliant: Manufactured to comply with RoHS requirements for modern production processes.
• Tightly specified core supply: 1.425 V to 1.575 V supply range enables predictable power design and system integration.

Why Choose A3P1000-FGG256I?

The A3P1000-FGG256I positions itself as a robust, industrial-grade programmable-logic option for designs that require a balance of logic density, I/O capability, and compact packaging. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 177 I/O make it suitable for projects needing substantial on-chip resources without sacrificing board-level density.

This device is well suited for engineering teams and procurement looking for a durable FPGA solution that supports moderate to complex digital implementations within industrial temperature environments while maintaining RoHS compliance.

Request a quote or submit a purchase inquiry to evaluate the A3P1000-FGG256I for your next programmable logic design.