A3P1000-FGG256M

The A3P1000-FGG256M is a military-grade ProASIC3/EL flash FPGA from Microchip Technology, designed for low-power, non-volatile programmable logic in demanding environments. It combines a flash-based FPGA architecture with Flash*Freeze technology to support designs that require configurable logic, on-chip embedded memory, and extended temperature operation.

Targeted at defense and rugged embedded systems, the device delivers a balance of integration and reliability with a 256-LBGA package, 177 I/Os, and qualification to MIL-STD-883.

Key Features

• Core logic  24,576 logic elements providing approximately 1,000,000 equivalent gates for complex combinational and sequential designs.
• Embedded memory  Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, FIFOs, and small data stores.
• I/O density  177 general-purpose I/Os to support multiple interfaces and peripheral connections from a single device.
• Non-volatile flash configuration  Flash-based FPGA architecture with Flash*Freeze technology for low-power standby and retained configuration.
• Power supply range  Operates from 1.14 V to 1.575 V, enabling integration into designs with low-voltage core rails.
• Rugged qualification  Military grade with qualification to MIL-STD-883 and operating temperature range of −55°C to 125°C for harsh environments.
• Package and mounting  256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact board layouts.
• Environmental compliance  RoHS compliant.

Typical Applications

• Military and aerospace systems  Use as configurable logic in avionics, tactical electronics, and ruggedized datalinks where MIL-STD-883 qualification and extended temperature range are required.
• Defense communications  Implement protocol processing, packet handling, or custom interface bridging using the device's abundant logic resources and I/O count.
• Embedded signal processing  Deploy for deterministic processing tasks that benefit from on-chip memory and high gate density.

Unique Advantages

• Military-grade reliability: Qualification to MIL-STD-883 and operation from −55°C to 125°C supports deployment in harsh and mission-critical environments.
• Non-volatile, low-power configuration: Flash-based architecture with Flash*Freeze technology enables retained configuration and reduced standby power.
• High integration in a compact package: 24,576 logic elements and 177 I/Os in a 256-LBGA (17×17) surface-mount package reduce BOM and board area.
• Flexible voltage support: 1.14 V to 1.575 V core voltage range accommodates modern low-voltage system designs.
• On-chip memory resources: Approximately 0.15 Mbits of embedded RAM for local buffering and state storage without external memory.
• Regulatory and environmental compliance: RoHS compliance simplifies regulatory management for manufactured systems.

Why Choose A3P1000-FGG256M?

The A3P1000-FGG256M positions itself as a rugged, flash-configured FPGA option for military and defense-oriented designs that require non-volatile configuration, extended temperature operation, and formal MIL-STD-883 qualification. Its combination of 24,576 logic elements, roughly 0.15 Mbits of embedded RAM, and 177 I/Os provides a versatile platform for mid-density programmable logic tasks.

Engineers and procurement teams designing mission-focused embedded systems will find the device well suited for applications that demand long-term reliability, compact packaging, and low-power retained configuration. Backed by Microchip Technology's ProASIC3/EL family documentation, the A3P1000-FGG256M offers a clear specification set for integration into rugged systems.

Request a quote or submit an inquiry for pricing and availability of the A3P1000-FGG256M to begin evaluation and procurement for your next rugged embedded design.