A3P1000-FGG256

The A3P1000-FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers mid-range programmable logic capacity and embedded memory in a compact 256-LBGA footprint for commercial applications.

With up to 1,000,000 gates, 24,576 logic elements and approximately 0.147 Mbits of embedded memory, this device targets designs that require a balance of logic density, on-chip RAM and flexible I/O in a surface-mount package.

Key Features

• Logic Capacity Up to 1,000,000 gates and 24,576 logic elements, enabling implementation of moderate-complexity digital designs.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for local data storage and buffering.
• Flexible I/O 177 user I/O pins to support diverse peripheral and bus interfacing requirements.
• Power Single supply operating window from 1.425 V to 1.575 V for core power planning.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) designed for surface-mount assembly.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard embedded product environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• I/O-Intensive Control Systems Designs that require up to 177 I/O for interfacing sensors, actuators and peripheral devices.
• Embedded Logic and Glue-Logic Implement mid-range digital functions and system glue logic using 24,576 logic elements and 1,000,000 gates.
• On-Board Data Buffering Use the device's approximately 0.147 Mbits of embedded RAM for local buffering and small data storage tasks.
• Compact Surface-Mount Designs Integrate programmable logic into space-constrained PCBs using the 256-LBGA surface-mount package.

Unique Advantages

• Balanced Logic and Memory: Combines 24,576 logic elements with approximately 0.147 Mbits of RAM to support a wide range of mid-complexity designs.
• Generous I/O Count: 177 I/O pins allow flexible interfacing without needing external I/O expanders.
• Compact, Manufacturable Package: 256-LBGA (256-FPBGA, 17×17) offers a high-density, surface-mount solution suitable for modern PCB assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet standard commercial product requirements.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose A3P1000-FGG256?

The A3P1000-FGG256 positions itself as a commercial-grade ProASIC3 FPGA offering a practical mix of logic density, embedded memory and I/O in a compact 256-LBGA package. It is well suited for engineers building embedded systems that need moderate programmable logic, local RAM and a high I/O count without moving to larger device classes.

Backed by Microchip Technology and specified for surface-mount assembly, this device provides a verifiable specification set for procurement and system design, including core supply range, package details, operating temperature and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability of the A3P1000-FGG256 to move your design forward.