A3P1000-FGG144I

The A3P1000-FGG144I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, offered in a 144-LBGA surface-mount package. It provides a balance of logic capacity, on-chip RAM, and I/O count in an industrial-grade device intended for designs that require robust thermal range and compact packaging.

With 24,576 logic elements and 147,456 bits of on-chip RAM, this device supports mid-density custom logic and interfacing tasks while operating from a single core supply voltage range of 1.425 V to 1.575 V.

Key Features

• Core Logic 24,576 logic elements (logic cells) and approximately 1,000,000 gates provide mid-density programmable logic capacity for custom digital designs.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) to support buffering, state storage, and small lookup tables without external memory.
• I/O Capacity Up to 97 general-purpose I/O pins to support parallel interfaces, control lines, and peripheral connectivity.
• Power Single core supply voltage range of 1.425 V to 1.575 V for straightforward power-rail planning.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for space-constrained PCBs.
• Industrial Thermal Grade Rated for operation from -40°C to 100°C to meet extended-temperature deployment requirements.
• Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and robust logic capacity make the device suitable for control, sequencing, and interfacing tasks in industrial systems.
• Embedded Logic and Prototyping — Provides 24,576 logic elements and on-chip RAM to implement custom finite state machines, data processing blocks, and system glue logic during development and deployment.
• I/O-Intensive Peripherals — Up to 97 I/Os support parallel sensor interfaces, control signals, and peripheral connectivity in compact boards.
• Space-Constrained System Boards — 144-FPBGA (13×13) surface-mount packaging enables dense PCB layouts where board real estate is limited.

Unique Advantages

• Balanced Logic and Memory: 24,576 logic elements combined with 147,456 bits of on-chip RAM provide a practical mix for mid-range FPGA tasks without requiring external memory.
• Industrial Thermal Range: Rated operation from -40°C to 100°C supports deployment in environments with wide temperature variation.
• Compact BGA Package: 144-LBGA (144-FPBGA, 13×13) allows high-density board implementation while maintaining a surface-mount profile.
• Ample I/O for Interfaces: Ninety-seven available I/Os facilitate multiple peripheral connections and parallel interfacing requirements.
• Simple Power Planning: Defined core voltage range of 1.425–1.575 V enables predictable power-supply design.
• RoHS Compliant: Meets RoHS requirements to simplify regulatory and manufacturing considerations.

Why Choose A3P1000-FGG144I?

The A3P1000-FGG144I positions itself as an industrial-grade mid-density FPGA option that combines a substantial logic element count, measurable on-chip RAM, and a generous I/O complement in a compact BGA package. Its specified operating temperature range and RoHS compliance make it well suited for applications where environmental robustness and regulatory compatibility matter.

This device is appropriate for engineers and designers implementing embedded logic, control functions, and I/O-rich subsystems who require predictable power and thermal characteristics together with a compact form factor.

Request a quote or submit an inquiry to discuss availability and pricing for the A3P1000-FGG144I and to evaluate how it fits your design requirements.