A3P1000-FG484T

IC FPGA 300 I/O 484FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BGANumber of I/O300Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits147456

Overview of A3P1000-FG484T – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA

The A3P1000-FG484T is a ProASIC3 Flash-based FPGA from Microchip Technology designed for embedded and automotive-grade applications. It combines a high density of programmable logic with on-chip embedded memory and a broad I/O complement to support complex control and signal-processing tasks.

With AEC-Q100 qualification, a wide operating temperature range, and a compact 484-BGA package, this device targets designs that require robust performance, reliable operation across temperature extremes, and a high level of integration.

Key Features

  • Logic Capacity  Approximately 24,576 logic elements providing the programmable resources to implement custom logic, state machines, and data-path functions.
  • Gate Equivalent  About 1,000,000 gates to support medium-density FPGA designs and integration of multiple functions into a single device.
  • Embedded Memory  Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for buffering, FIFOs, and small lookup tables.
  • I/O Density  300 user I/O pins to interface with sensors, peripherals, and high-pin-count system buses.
  • Power and Supply  Operates from a core supply range of 1.425 V to 1.575 V for predictable power-domain design.
  • Automotive Qualification & Grade  Rated as Automotive grade with AEC-Q100 qualification for use in qualifying automotive electronic systems.
  • Package & Mounting  484-ball BGA in supplier package 484-FPBGA (23x23), surface mount for compact PCB integration.
  • Operating Temperature  Specifies an operating range from −40 °C to 125 °C to support harsh-environment deployments.
  • Environmental Compliance  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

  • Automotive Control Systems  Used for vehicle control logic, gateway functions, and sensor interfacing where AEC-Q100 qualification and wide temperature operation are required.
  • Industrial Automation  Implements custom control algorithms and real-time I/O aggregation for factory automation and motion control systems.
  • Embedded Signal Processing  Hosts mid-density processing tasks and buffering using its logic elements and on-chip RAM for sensor data conditioning and protocol translation.
  • Telecommunications & Networking  Provides flexible I/O and programmable logic to implement interface bridging, packet processing, and custom protocol support.

Unique Advantages

  • Automotive-Ready Qualification: AEC-Q100 qualification and Automotive grade designation provide traceable suitability for automotive electronic designs.
  • High Integration Density: Around 24,576 logic elements and one million gates reduce the need for multiple discrete devices, simplifying system architecture.
  • Generous I/O Count: 300 I/O pins enable direct connection to many peripherals and sensors, minimizing external interface components.
  • Wide Temperature Operation: Specified operation from −40 °C to 125 °C supports deployments in extreme environmental conditions.
  • Compact BGA Packaging: 484-BGA (484-FPBGA, 23x23) surface-mount package allows a small PCB footprint while maintaining high pin density.
  • Regulatory Compliance: RoHS compliance for lead-free manufacturing and environmental regulatory alignment.

Why Choose A3P1000-FG484T?

The A3P1000-FG484T positions itself as a robust, mid-density flash FPGA for applications that require programmable logic with automotive-grade reliability. Its combination of logic resources, embedded memory, high I/O count, and AEC-Q100 qualification makes it suitable for designers seeking a compact, integrated solution for harsh environments.

This device is well suited to engineering teams developing automotive and industrial systems that need long-term availability, predictable operating behavior across temperature extremes, and the integration benefits of a single-chip programmable solution backed by Microchip Technology.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the A3P1000-FG484T.

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