A3P1000-FG484T
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 642 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 147456 |
Overview of A3P1000-FG484T – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA
The A3P1000-FG484T is a ProASIC3 Flash-based FPGA from Microchip Technology designed for embedded and automotive-grade applications. It combines a high density of programmable logic with on-chip embedded memory and a broad I/O complement to support complex control and signal-processing tasks.
With AEC-Q100 qualification, a wide operating temperature range, and a compact 484-BGA package, this device targets designs that require robust performance, reliable operation across temperature extremes, and a high level of integration.
Key Features
- Logic Capacity Approximately 24,576 logic elements providing the programmable resources to implement custom logic, state machines, and data-path functions.
- Gate Equivalent About 1,000,000 gates to support medium-density FPGA designs and integration of multiple functions into a single device.
- Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for buffering, FIFOs, and small lookup tables.
- I/O Density 300 user I/O pins to interface with sensors, peripherals, and high-pin-count system buses.
- Power and Supply Operates from a core supply range of 1.425 V to 1.575 V for predictable power-domain design.
- Automotive Qualification & Grade Rated as Automotive grade with AEC-Q100 qualification for use in qualifying automotive electronic systems.
- Package & Mounting 484-ball BGA in supplier package 484-FPBGA (23x23), surface mount for compact PCB integration.
- Operating Temperature Specifies an operating range from −40 °C to 125 °C to support harsh-environment deployments.
- Environmental Compliance RoHS compliant to meet lead-free manufacturing requirements.
Typical Applications
- Automotive Control Systems Used for vehicle control logic, gateway functions, and sensor interfacing where AEC-Q100 qualification and wide temperature operation are required.
- Industrial Automation Implements custom control algorithms and real-time I/O aggregation for factory automation and motion control systems.
- Embedded Signal Processing Hosts mid-density processing tasks and buffering using its logic elements and on-chip RAM for sensor data conditioning and protocol translation.
- Telecommunications & Networking Provides flexible I/O and programmable logic to implement interface bridging, packet processing, and custom protocol support.
Unique Advantages
- Automotive-Ready Qualification: AEC-Q100 qualification and Automotive grade designation provide traceable suitability for automotive electronic designs.
- High Integration Density: Around 24,576 logic elements and one million gates reduce the need for multiple discrete devices, simplifying system architecture.
- Generous I/O Count: 300 I/O pins enable direct connection to many peripherals and sensors, minimizing external interface components.
- Wide Temperature Operation: Specified operation from −40 °C to 125 °C supports deployments in extreme environmental conditions.
- Compact BGA Packaging: 484-BGA (484-FPBGA, 23x23) surface-mount package allows a small PCB footprint while maintaining high pin density.
- Regulatory Compliance: RoHS compliance for lead-free manufacturing and environmental regulatory alignment.
Why Choose A3P1000-FG484T?
The A3P1000-FG484T positions itself as a robust, mid-density flash FPGA for applications that require programmable logic with automotive-grade reliability. Its combination of logic resources, embedded memory, high I/O count, and AEC-Q100 qualification makes it suitable for designers seeking a compact, integrated solution for harsh environments.
This device is well suited to engineering teams developing automotive and industrial systems that need long-term availability, predictable operating behavior across temperature extremes, and the integration benefits of a single-chip programmable solution backed by Microchip Technology.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the A3P1000-FG484T.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D