A3P1000-FG256T

The A3P1000-FG256T is a ProASIC3 family field programmable gate array from Microchip Technology. It provides a balance of programmable logic resources, on-chip memory and I/O capacity in a compact 256‑ball LFBGA package targeted at designs that require qualified, robust components.

With 24,576 logic elements, approximately 147 kbits of embedded RAM and 177 I/Os, this device is suited to embedded and automotive-aware applications that need deterministic supply and thermal ranges, plus AEC‑Q100 qualification for automotive reliability.

Key Features

• Core Logic 24,576 logic elements (logic element cells) delivering up to 1,000,000 gates of programmable logic capacity for custom digital functions.
• On‑Chip Memory 147,456 bits of total RAM (approximately 147 kbits) for data buffering, state storage and small embedded memory needs.
• I/O Capacity 177 user I/Os to support broad peripheral connectivity and interface aggregation without extensive external glue logic.
• Package & Mounting 256‑LBGA package (supplier package: 256‑FPBGA, 17×17) in a surface‑mount footprint for compact PCB integration.
• Power Operating supply range of 1.425 V to 1.575 V to match system voltage requirements within defined tolerances.
• Temperature Range Rated for operation from −40°C to 125°C to support designs that require extended temperature capability.
• Automotive Qualification AEC‑Q100 qualification and Automotive grade designation for applications requiring that industry qualification.
• Regulatory Compliance RoHS compliant to meet common environmental and material requirements.

Typical Applications

• Automotive Systems AEC‑Q100 qualification and extended temperature range make this FPGA suitable for automotive control and signal processing modules that require qualified components.
• Embedded Control and Interface Aggregation High I/O count and substantial logic resources enable consolidation of multiple control and interface functions into a single programmable device.
• Custom Logic and Data Processing The combination of logic elements and on‑chip RAM supports implementation of application‑specific processing, protocol bridging and timing‑critical functions.

Unique Advantages

• Qualified for automotive use: AEC‑Q100 qualification and Automotive grade designation provide documented suitability for designs that require automotive industry qualification.
• High logic density: 24,576 logic elements and approximately 1,000,000 gates allow integration of complex digital functions that reduce the need for discrete ASICs or multiple components.
• Ample I/O integration: 177 I/Os support multiple interfaces and sensors directly, simplifying board-level connectivity and lowering component count.
• Extended temperature and stable supply range: −40°C to 125°C operating range and defined 1.425–1.575 V supply window support robust operation across demanding environments.
• Compact surface‑mount package: The 256‑LBGA (256‑FPBGA, 17×17) package enables space-efficient PCB designs while providing a high pin count.
• Regulatory readiness: RoHS compliance helps simplify environmental conformity in end products.

Why Choose A3P1000-FG256T?

The A3P1000-FG256T positions programmable logic, meaningful on‑chip memory and substantial I/O in a qualified, automotive‑grade device. Its combination of 24,576 logic elements, 147,456 bits of RAM and 177 I/Os enables consolidation of multiple functions into a single IC, reducing BOM complexity and board space for embedded and automotive‑oriented designs.

This device is well suited to engineers and teams developing designs that require AEC‑Q100 qualification, extended operating temperatures and a compact BGA footprint. It delivers a balance of integration, connectivity and environmental capability for long‑life applications backed by Microchip Technology’s family-level documentation.

Request a quote or submit an inquiry to our sales team to evaluate A3P1000-FG256T for your next design or to obtain pricing and availability information.