A3P1000-FG256I

The A3P1000-FG256I is a ProASIC3 field programmable gate array (FPGA) IC offering measurable on-chip resources for custom digital logic. It provides 24,576 logic elements, approximately 1,000,000 gates and 177 general-purpose I/Os to support a range of embedded logic functions.

Designed for surface-mount applications, the device is supplied in a 256-LBGA package (supplier package: 256-FPBGA, 17x17) and operates over an industrial temperature range of −40 °C to 100 °C with a device supply range of 1.425 V to 1.575 V. The device is RoHS compliant.

Key Features

• Logic Capacity 24,576 logic elements and approximately 1,000,000 gates enable integration of complex combinational and sequential logic.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 bits) for buffering, small data tables, and state storage.
• I/O Resources 177 device I/Os provide flexible external interfacing for peripherals and board-level signals.
• Package and Mounting Supplied in a 256‑LBGA surface-mount package (256‑FPBGA, 17x17) suited for compact PCB implementations.
• Power Supply Core voltage specified at 1.425 V to 1.575 V for predictable power planning and regulator selection.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to accommodate temperature-sensitive deployments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic density: 24,576 logic elements and ~1,000,000 gates allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial I/O count: 177 I/Os provide flexibility for interfacing multiple peripherals, sensors, or external logic domains.
• On-chip RAM for local buffering: Approximately 0.15 Mbits of embedded memory supports local data storage and intermediate buffering without external RAM.
• Industrial robustness: −40 °C to 100 °C operating range supports deployments in thermally demanding environments.
• Compact, surface-mount package: 256‑LBGA (256‑FPBGA, 17x17) enables space-efficient PCB layouts for dense system designs.
• RoHS compliant: Meets common environmental directives for lead-free manufacturing.

Why Choose A3P1000-FG256I?

The A3P1000-FG256I combines substantial logic and I/O resources with on-chip memory and an industrial temperature rating, offering a balanced platform for embedded digital designs that require integration without extensive external components. Its compact 256‑LBGA footprint and defined supply and thermal ranges make it suitable for engineers specifying predictable electrical and environmental behavior.

This device is appropriate for customers seeking a field-programmable solution with measurable logic capacity, a high I/O count, and explicit operating specifications for robust system-level integration and procurement planning.

Request a quote or submit a procurement inquiry to obtain pricing, lead time and availability for the A3P1000-FG256I.