A3P1000-FG144M

The A3P1000-FG144M is a ProASIC3 Field Programmable Gate Array (FPGA) IC supplied in a 144-LBGA package. It provides 24,576 logic elements (approximately 1,000,000 gates), 97 I/O and on-chip RAM to implement mid-density programmable logic functions.

Built and qualified for military use, the device is MIL-STD-883 qualified, RoHS compliant, and rated for operation from -55°C to 125°C with a supply voltage range of 1.425 V to 1.575 V.

Key Features

• Core / Logic 24,576 logic elements providing approximately 1,000,000 gates for implementing combinational and sequential logic.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 bits) for data buffering and state storage.
• I/O 97 user I/O pins to support a variety of peripheral and system interfaces.
• Package & Mounting 144-LBGA (supplier device package: 144-FPBGA, 13×13) in a surface-mount footprint for compact board integration.
• Power Designed for a controlled core supply range of 1.425 V to 1.575 V.
• Temperature & Qualification Military grade device qualified to MIL-STD-883 and specified for operation from -55°C to 125°C.
• Compliance RoHS compliant.

Typical Applications

• Military and Aerospace Systems — Deployable logic for MIL-STD-883–qualified designs requiring extended temperature operation and rugged qualification.
• High-Reliability Embedded Control — Control and signal-processing functions that benefit from 24,576 logic elements and on-chip RAM.
• Compact Surface-Mount Designs — Space-constrained PCBs that require a 144-LBGA (13×13) surface-mount FPGA solution.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and a specified -55°C to 125°C operating range support deployment in demanding environments.
• Substantial Logic Capacity: 24,576 logic elements and roughly 1,000,000 gates enable implementation of complex logic and state machines.
• On-Chip Memory: Approximately 0.147 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks.
• Generous I/O Count: 97 I/O pins simplify interfacing with peripherals and system buses without extensive external glue logic.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) minimizes PCB footprint while supporting standard surface-mount assembly.
• Predictable Power Envelope: Narrow supply range (1.425 V–1.575 V) helps simplify power-rail design and regulation considerations.

Why Choose A3P1000-FG144M?

The A3P1000-FG144M positions itself as a military-grade FPGA option where long-term reliability, temperature tolerance, and formal qualification matter. With 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and 97 I/O, it supports mid-density programmable logic needs within a compact 144-LBGA footprint.

This device is suited for customers designing rugged embedded systems and mission-critical equipment that require MIL-STD-883 qualification, a defined supply voltage range, and operation across a wide temperature span. Its combination of logic capacity, I/O availability, and package density provides a straightforward building block for dependable, space-conscious designs.

Request a quote or submit a procurement inquiry to learn about availability and pricing for the A3P1000-FG144M.