A3P1000-2PQG208

The A3P1000-2PQG208 is a ProASIC3 family Field Programmable Gate Array (FPGA) from Microchip Technology, provided in a 208-BFQFP surface-mount package. It delivers a balance of programmable logic, embedded memory, and I/O density for commercial embedded designs that require customizable digital logic and peripheral interfacing.

Key architectural quantities include 24,576 logic elements, approximately 0.147 Mbits of on-chip RAM, and 154 programmable I/O pins, enabling integration of custom logic, glue-logic and protocol handling within a single device footprint.

Key Features

• Core Logic 24,576 logic elements and an estimated 1,000,000 gates provide substantial capacity for custom digital implementations.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM for buffering, state storage, and small data tables without external memory.
• I/O Density 154 programmable I/O pins support a variety of peripheral interfaces and board-level interconnect requirements.
• Package and Mounting 208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount form factor suited to compact PCB layouts.
• Power Core supply voltage range 1.425 V to 1.575 V to match system power rails and design requirements.
• Operating Conditions Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory RoHS compliant, supporting environmental and material compliance objectives.

Typical Applications

• Custom digital logic Implement finite state machines, peripheral controllers and protocol handlers using available logic elements and on-chip RAM.
• Interface bridging and I/O aggregation Use the 154 I/O pins to consolidate multiple interfaces or perform format conversion between subsystems.
• Embedded control and glue logic Integrate control functions and timing-critical logic to reduce external component count and simplify PCB routing.

Unique Advantages

• Substantial programmable capacity: 24,576 logic elements and ~1,000,000 gates provide the headroom to replace multiple discrete logic devices with a single FPGA.
• On-chip RAM for compact designs: Approximately 0.147 Mbits of embedded memory reduces dependency on external RAM for small buffers and lookup tables.
• High I/O count: 154 I/Os enable direct connection to numerous peripherals and signals, minimizing the need for external multiplexers.
• Surface-mount 208-BFQFP package: A compact 28×28 supplier package suits space-constrained PCBs while remaining assembly-friendly.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial product requirements.
• Clear power envelope: Defined core supply range (1.425 V–1.575 V) aids predictable integration into system power architectures.

Why Choose A3P1000-2PQG208?

The A3P1000-2PQG208 combines a large pool of logic elements, embedded RAM and a high I/O count in a compact 208-BFQFP surface-mount package, making it suitable for commercial embedded designs that need on-board programmable logic and interface consolidation. Its defined power range and commercial temperature rating simplify system-level integration while RoHS compliance supports environmental requirements.

This device is appropriate for engineers seeking a Microchip Technology ProASIC3 FPGA to consolidate discrete logic, implement custom control functions, or prototype complex digital subsystems with a single, well-specified component.

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