A3P1000-2PQG208I

The A3P1000-2PQG208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for user-defined digital logic implementations. It provides 24,576 logic elements and approximately 0.15 Mbits of embedded memory to support a wide range of configurable logic functions.

Packaged in a 208-BFQFP surface-mount package with 154 I/O pins and operating over an industrial temperature range, this device addresses designs that require a balance of logic density, on-chip memory, and robust environmental performance.

Key Features

• Core Logic  24,576 logic elements (cells) delivering capacity for complex, user-defined digital functions and up to 1,000,000 equivalent gates for logic-intensive designs.
• Embedded Memory  Total on-chip RAM of 147,456 bits, providing approximately 0.15 Mbits of embedded memory for data buffering and lookup tables.
• I/O Count  154 general-purpose I/O pins to support multiple external interfaces and parallel connectivity in a single package.
• Package & Mounting  208-BFQFP (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB implementations.
• Power  Nominal supply range from 1.425 V to 1.575 V to match system power rails requiring low-voltage core operation.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
• Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Custom Digital Logic  Implement user-defined combinational and sequential logic for prototype or production systems requiring reconfigurability.
• Embedded System Interfaces  Serve as a programmable glue logic or protocol adapter using available I/O and on-chip memory for buffering.
• Industrial Control  Deploy in control and automation equipment where industrial temperature range and surface-mount packaging are required.
• High-Density I/O Implementations  Support designs that require many external signals with the device's 154 I/O pins.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements provide the capacity to implement complex digital functions without external glue logic.
• On-Chip Memory: Approximately 0.15 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage.
• Compact, High-Pin Package: 208-BFQFP surface-mount package balances pin count and board space for dense designs.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• High I/O Count: 154 I/O pins enable direct interfacing to multiple peripherals and parallel buses.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose A3P1000-2PQG208I?

The A3P1000-2PQG208I positions itself as a balanced FPGA option for designers who need substantial logic density and on-chip memory in a surface-mount 208-BFQFP package. Its combination of 24,576 logic elements, approximately 0.15 Mbits of RAM, and 154 I/O pins suits projects that require flexible, user-defined digital logic with a robust industrial operating range.

This device is well suited for teams developing configurable embedded systems, industrial controllers, or custom interface logic that benefit from integrated memory, a high I/O count, and RoHS compliance. The specified voltage and temperature ranges provide predictable integration into controlled power and thermal designs.

Request a quote or submit an inquiry to receive pricing and availability for the A3P1000-2PQG208I and evaluate how it fits your next programmable logic design.