A3P1000-FG144

The A3P1000-FG144 is a ProASIC3 family Field Programmable Gate Array (FPGA) IC that provides 24,576 logic elements and approximately 1,000,000 equivalent gates. It integrates 147,456 bits of on-chip RAM and 97 general-purpose I/O pins in a compact 144-LBGA package.

Designed for commercial-temperature applications, this surface-mount FPGA targets designs that require moderate logic density, embedded memory, and a high I/O count in a small-footprint package while meeting RoHS environmental requirements.

Key Features

• Core Logic 24,576 logic elements (LAB/CLB equivalent) providing approximately 1,000,000 gates for moderate-density digital designs.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.147 Mbits) for buffering, state storage, and small data tables.
• I/O 97 available I/O pins to interface with peripherals, sensors, and external logic.
• Power Core voltage supply range of 1.425 V to 1.575 V for designs targeting this supply domain.
• Package & Mounting 144-LBGA package (supplier package: 144-FPBGA, 13 × 13 mm) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade Commercial grade device specified for operation over 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction to support regulatory requirements for lead-free designs.

Typical Applications

• Embedded Control and Logic Implement control state machines and custom digital logic where 24,576 logic elements and on-chip RAM meet design needs.
• Peripheral and Sensor Interfaces Use the 97 I/Os to aggregate, translate, and condition signals between sensors, peripherals, and host controllers.
• Prototyping and Development Rapidly validate hardware architectures and algorithm implementation in a compact FPGA package during development cycles.
• Communications and Protocol Bridging Realize protocol conversion and interface glue logic leveraging available logic density and embedded RAM for buffering.

Unique Advantages

• Balanced Logic and Memory: Combines 24,576 logic elements with 147,456 bits of embedded RAM to support a wide range of moderate-complexity designs without external memory.
• High I/O Density: 97 I/O pins enable flexible interfacing options for multi-peripheral systems and sensor arrays.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA 13×13) minimizes PCB area while maintaining robust connectivity for production boards.
• Commercial-Temperature Specification: Rated for 0 °C to 85 °C operation to match typical commercial electronic applications.
• RoHS Compliant: Meets lead-free environmental requirements for modern product assemblies.

Why Choose A3P1000-FG144?

The A3P1000-FG144 delivers a practical combination of logic density, embedded memory, and I/O capability in a compact 144-LBGA surface-mount package. Its 24,576 logic elements and approximately 147,456 bits of on-chip RAM make it well-suited to designers seeking a commercial-grade FPGA for control logic, interfacing, and moderate-complexity digital functions.

This device is appropriate for teams focused on compact board layouts and predictable commercial-temperature operation who require RoHS compliance. Its specifications provide a clear basis for evaluating suitability in embedded systems, prototyping, and interface-aggregation designs.

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