A3P1000-FG256

The A3P1000-FG256 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, supplied in a 256-LBGA package. It combines a high logic element count with significant I/O capacity and on-chip memory to address commercial embedded designs that require configurable logic.

With 24,576 logic elements, approximately 0.15 Mbits of embedded memory, 177 I/O pins and a 1,000,000-gate equivalent, the device targets commercial applications that need programmable integration and dense I/O in a surface-mount LBGA footprint. The device is RoHS compliant and rated for commercial temperature operation.

Key Features

• Logic Capacity  24,576 logic elements provide substantial programmable logic resources for implementing custom digital functions.
• On-Chip Memory  Approximately 0.15 Mbits of embedded RAM (147,456 bits) for data buffering, state storage and small lookup tables.
• Gate Equivalent  Represents a 1,000,000-gate equivalent device for sizing and partitioning complex logic designs.
• I/O Resources  177 I/O pins accommodate extensive external interfacing and parallel signal routing in commercial systems.
• Power and Supply  Operates from a core supply range of 1.425 V to 1.575 V, enabling consistent integration with matched power domains.
• Package and Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level implementation.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for regulatory alignment in commercial product assemblies.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and data-path functions that benefit from reprogrammable logic and significant I/O.
• Prototyping and Evaluation  Use the device for development and validation of programmable-logic designs requiring moderate density and I/O count.
• I/O-Intensive Commercial Equipment  Serve as an interface or glue-logic element where many external signals must be aggregated, routed or processed.
• Custom Logic and Glue Logic  Replace discrete logic or ASIC slices with programmable logic to reduce BOM complexity and speed design iterations.

Unique Advantages

• High Logic Density:  24,576 logic elements allow integration of complex functions into a single FPGA, reducing external components.
• Significant I/O Count:  177 I/Os provide flexibility for parallel interfaces and multi-channel connectivity without external expanders.
• Compact Surface-Mount Package:  256-LBGA (17×17) offers a small board footprint for space-constrained commercial designs.
• Clear Power Envelope:  Defined core supply range (1.425 V to 1.575 V) helps streamline power-supply design and system integration.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation to match typical commercial product requirements.
• Regulatory Compliance:  RoHS compliance supports environmental requirements for commercial manufacturing.

Why Choose A3P1000-FG256?

The A3P1000-FG256 positions itself as a commercially rated ProASIC3 FPGA option for designs that require substantial programmable logic, a high number of I/Os and embedded memory in a compact LBGA package. Its combination of 24,576 logic elements, approximately 0.15 Mbits of RAM and 177 I/Os makes it well suited to commercial embedded applications where reconfigurable logic and board-level integration matter.

Manufactured by Microchip Technology, the device is RoHS compliant and supplied in a surface-mount 256-LBGA package, providing a balanced solution for product teams focused on scalability, integration and repeatable commercial production.

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