A3P1000-FG256M

The A3P1000-FG256M is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offered in a 256-LBGA package. This military-grade, surface-mount FPGA provides a programmable fabric with substantial logic capacity, on-chip memory, and a high I/O count for demanding embedded and defense applications.

Qualified to MIL-STD-883 and rated for operation from -55 °C to 125 °C, the device is tailored for systems requiring rugged performance, explicit voltage range support, and compact BGA packaging.

Key Features

• Logic Capacity 1,000,000 gates implemented as 24,576 logic elements to support complex digital designs and custom implementations.
• On-Chip Memory 147,456 bits of total RAM (approximately 0.147 Mbits) for embedded data buffering, state storage, and small lookup tables.
• I/O Resources 177 I/O pins to accommodate extensive peripheral interfacing and multi-channel connectivity.
• Power Supply Supported core voltage range from 1.14 V to 1.575 V for integration with low-voltage system rails.
• Package and Mounting 256-LBGA package, supplier device package 256-FPBGA (17×17), designed for surface-mount PCB assembly.
• Temperature and Qualification Military grade with MIL-STD-883 qualification and an operating temperature range of -55 °C to 125 °C for rugged deployments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Military and Aerospace Systems — MIL-STD-883 qualification and a -55 °C to 125 °C operating range make this FPGA suitable for ruggedized digital logic in defense and aerospace electronics.
• Communications and Protocol Processing — The combination of 1,000,000 gates, 24,576 logic elements, and 177 I/Os supports custom protocol implementation and multi-channel interfacing.
• Embedded Control and Signal Processing — On-chip memory and a sizable logic fabric enable embedded control logic, signal handling, and data-path implementations in constrained form factors.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification and extended temperature rating support deployment in harsh and safety-conscious environments.
• High Logic Density: 24,576 logic elements and 1,000,000 gates provide capacity for complex custom functions and integration of multiple subsystems on a single device.
• Generous I/O Count: 177 I/Os enable broad peripheral connectivity and flexible board-level partitioning.
• Compact BGA Packaging: 256-LBGA / 256-FPBGA (17×17) package balances board space efficiency with high pin count for dense designs.
• Wide Core Voltage Support: 1.14 V to 1.575 V supply range allows compatibility with low-voltage system architectures.
• Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose A3P1000-FG256M?

The A3P1000-FG256M positions itself as a rugged, programmable logic solution for designers who require military-grade qualification, broad operating temperature range, and a substantial mix of logic, memory, and I/O resources. Its combination of 1,000,000 gates, 24,576 logic elements, and 177 I/Os enables consolidation of multiple functions into a single FPGA for compact, reliable system designs.

Backed by Microchip Technology and qualified to MIL-STD-883, this device is well suited for teams developing defense, aerospace, and other harsh-environment electronics that demand long-term reliability and a compact, high-density package.

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